Ghent University Academic Bibliography

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Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling

Nivesh Mangal, Bradley Snyder, Joris Van Campenhout, Geert Van Steenberge (UGent) and Jeroen Missinne (UGent)

(2021) OPTICS EXPRESS. 29(5). p.7601-7615
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Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics

Nivesh Mangal, Bradley Snyder, Joris Van Campenhout, Geert Van Steenberge (UGent) and Jeroen Missinne (UGent)

(2020) IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS. 26(2).
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Ball lens embedded through-package via to enable backside coupling between silicon photonics interposer and board-level interconnects

Nivesh Mangal, Jeroen Missinne (UGent) , Joris Van Campenhout, Bradley Snyder and Geert Van Steenberge (UGent)

(2020) JOURNAL OF LIGHTWAVE TECHNOLOGY. 38(8). p.2360-2369
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Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects

Nivesh Mangal, Jeroen Missinne (UGent) , Joris Van Campenhout, Geert Van Steenberge (UGent) and Bradley Snyder

(2019) OPTICAL INTERCONNECTS XIX. In Proceedings of SPIE 10924.
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Performance evaluation of backside emitting O-Band grating couplers for 100 μm-thick silicon photonics interposers

Nivesh Mangal, Jeroen Missinne (UGent) , Geert Van Steenberge (UGent) , Joris Van Campenhout and Bradley Snyder

(2019) IEEE PHOTONICS JOURNAL. 11(3). p.1-1
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Alignment-tolerant interfacing of a photonic integrated circuit using back side etched silicon microlenses

Jeroen Missinne (UGent) , Nuria Teigell Beneitez (UGent) , Nivesh Mangal, Jing Zhang (UGent) , Anton Vasiliev (UGent) , Joris Van Campenhout, Bradley Snyder, Günther Roelkens (UGent) and Geert Van Steenberge (UGent)

(2019) SILICON PHOTONICS XIV. In Proceedings of SPIE 10923.
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Packaging and assembly challenges for 50G silicon photonics interposers

Bradley Snyder, Nivesh Mangal, Guy Lepage, Sadhishkumar Balakrishnan, Xiao Sun, Nicolas Pantano, Michal Rakowski, Lieve Bogaerts, Peter De Heyn (UGent) , Peter Verheyen, et al.

(2018) 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC).
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High-bandwidth density optically interconnected terabit/s boards

Xin Yin (UGent) , Dries Van Thourhout (UGent) , Joan Juvert Sandez, Roberto Osellame, Rebeca Martínez Vázquez, Diogo P. Lopes, Giovanni Battista Preve, Aina A. Serrano Rodrigo, Paola Galli, Guido Chiaretti, et al.

(2018) METRO AND DATA CENTER OPTICAL NETWORKS AND SHORT-REACH LINKS. In Proceedings of SPIE p.1-20

Academic Bibliography

Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling

Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics

Ball lens embedded through-package via to enable backside coupling between silicon photonics interposer and board-level interconnects

Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects

Performance evaluation of backside emitting O-Band grating couplers for 100 μm-thick silicon photonics interposers

Alignment-tolerant interfacing of a photonic integrated circuit using back side etched silicon microlenses

Packaging and assembly challenges for 50G silicon photonics interposers

High-bandwidth density optically interconnected terabit/s boards

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