Ghent University Academic Bibliography

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Integration of ball lens in through-package via to enable photonic chip-to-board coupling

Nivesh Mangal, Jeroen Missinne (UGent) , Joris Van Campenhout, Geert Van Steenberge (UGent) and Brad Snyder

(2018) 2018 IEEE 68th Electronic Components and Technology Conference (ECTC). In Electronic Components and Technology Conference p.1140-1145
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- Journal Article
- A1
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High extinction ratio hybrid graphene-silicon photonic crystal switch

Leili Abdollahi Shiramin (UGent) , Weiqiang Xie (UGent) , Brad Snyder, Peter De Heyn, Peter Verheyen, Günther Roelkens (UGent) and Dries Van Thourhout (UGent)

(2018) IEEE PHOTONICS TECHNOLOGY LETTERS. 30(2). p.157-160
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Integration of etched facet, electrically pumped, C-band Fabry-Perot lasers on a silicon photonic integrated circuit by transfer printing

Joan Juvert (UGent) , Tommaso Cassese, Sarah Uvin (UGent) , Andreas De Groote (UGent) , Brad Snyder, Lieve Bogaerts, Geraldine Jamieson, Joris Van Campenhout, Günther Roelkens (UGent) and Dries Van Thourhout (UGent)

(2018) OPTICS EXPRESS. 26(17). p.21443-21454
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- Conference Paper
- P1
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Electrically tunable absorption in graphene-integrated silicon photonics crystal cavity

Leili Abdollahi Shiramin (UGent) , Weiqiang Xie (UGent) , Brad Snyder, Peter De Heyn, Peter Verheyen, Günther Roelkens (UGent) and Dries Van Thourhout (UGent)

(2017) 2017 IEEE 14TH INTERNATIONAL CONFERENCE ON GROUP IV PHOTONICS (GFP). In IEEE International Conference on Group IV Photonics p.176-177
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- P1
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Integration of III-V light sources on a silicon photonics circuits by transfer printing

Joan Juvert (UGent) , Tommaso Cassese, Sarah Uvin (UGent) , Andreas De Groote (UGent) , Brad Snyder, Peter De Heyn, Peter Verheyen, Antonio Jose Trindade, Christopher Bower, Marco Romagnoli, et al.

(2017) 2017 IEEE 14TH INTERNATIONAL CONFERENCE ON GROUP IV PHOTONICS (GFP). In IEEE International Conference on Group IV Photonics p.166-167
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A 4x20Gb/s WDM ring-based hybrid CMOS silicon photonics transceiver

Michal Rakowski, Marianna Pantouvaki, Peter De Heyn, Peter Verheyen, Mark Ingels, Hongtao Chen (UGent) , Jeroen De Coster, Guy Lepage, Brad Snyder, Kristin De Meyer, et al.

(2015) IEEE International Solid State Circuits Conference. In IEEE International Solid State Circuits Conference 58. p.408-409

Academic Bibliography

Integration of ball lens in through-package via to enable photonic chip-to-board coupling

High extinction ratio hybrid graphene-silicon photonic crystal switch

Integration of etched facet, electrically pumped, C-band Fabry-Perot lasers on a silicon photonic integrated circuit by transfer printing

Electrically tunable absorption in graphene-integrated silicon photonics crystal cavity

Integration of III-V light sources on a silicon photonics circuits by transfer printing

A 4x20Gb/s WDM ring-based hybrid CMOS silicon photonics transceiver

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