Ghent University Academic Bibliography

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Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics

Nivesh Mangal (UGent) , Jeroen Missinne (UGent) , Günther Roelkens (UGent) , Jan Van Campenhout (UGent) , Geert Van Steenberge (UGent) and B. Snyder

(2018) 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC).
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- Conference Paper
- C3
- open access
Transfer printing for silicon photonics tranceivers and interposers

Günther Roelkens (UGent) , Jing Zhang (UGent) , Andreas De Groote (UGent) , Joan Juvert (UGent) , Nan Ye (UGent) , Sulakshna Kumari (UGent) , Jeroen Goyvaerts (UGent) , Grigorij Muliuk (UGent) , Sarah Uvin (UGent) , Guanyu Chen, et al.

(2018) Optical Interconnects Conference.
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Packaging silicon photonics with polymer waveguides for 3D electro-optical integration

Nivesh Mangal (UGent) , Jeroen Missinne (UGent) , Geert Van Steenberge (UGent) , J. Van Campenhout and B. Snyder

(2017) 30TH ANNUAL CONFERENCE OF THE IEEE PHOTONICS SOCIETY (IPC). p.707-708
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Ultra-dense 16x56Gb/s NRZ GeSi EAM-PD arrays coupled to multicore fiber for short-reach 896Gb/s optical links

P. De Heyn, V. I. Kopp, Srinivasan Ashwyn Srinivasan (UGent) , P. Verheyen, J. Park, M. S. Wlodawski, J. Singer, D. Neugroschl, B. Snyder, S. Balakrishnan, et al.

(2017) 2017 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC). p.1-3
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- Conference Paper
- P1
- open access
Reliable 50Gb/s silicon photonics platform for next-generation data center optical interconnects

P. Absil, K. Croes, A. Lesniewska, P. De Heyn, Y. Ban, B. Snyder, J. De Coster, F. Fodor, V. Simons, S. Balakrishnan, et al.

(2017) 2017 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM). In IEEE International Electron Devices Meeting

Academic Bibliography

Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics

Transfer printing for silicon photonics tranceivers and interposers

Packaging silicon photonics with polymer waveguides for 3D electro-optical integration

Ultra-dense 16x56Gb/s NRZ GeSi EAM-PD arrays coupled to multicore fiber for short-reach 896Gb/s optical links

Reliable 50Gb/s silicon photonics platform for next-generation data center optical interconnects

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