Ghent University Academic Bibliography

Your filters: cql: author="Siau, Sam" or (type any "bookEditor issueEditor" and editor="Siau, Sam")

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XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments

Sam Siau, B DE ROO and Alfons Vervaet (UGent)

(2007) 211th ECS Meeting - Chicago, Illinois F1 - Electrochemical Processing in ULSI and MEMS 3-Electrodeposition.
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Study of the failure mechanism of the Cu/epoxy interface after modifications by means of surface chemical reactions

Sam Siau and Alfons Vervaet (UGent)

(2006) ECS Transactions. 3(21). p.123-132
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- Journal Article
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Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics

Alfons Vervaet (UGent) , Sam Siau, Johan De Baets (UGent) and Boniface Manirambona (UGent)

(2006) APPLIED SURFACE SCIENCE. 252(23). p.8243-8250
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Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Sam Siau, Alfons Vervaet (UGent) , Lieven Degrendele (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) APPLIED SURFACE SCIENCE. 252(8). p.2717-2740
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Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , Ulric Demeter (UGent) and André Van Calster (UGent)

(2006) THIN SOLID FILMS. 495(1-2). p.348-356
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- Conference Paper
- C3
Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) and André Van Calster (UGent)

(2005) Meeting abstracts of the 207th Meeting 2005 The Electrochemical Society.. p.348-348
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The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper

Sam Siau, Alfons Vervaet (UGent) , André Van Calster (UGent) and Daniël Baert

(2005) Program of the Fifth International Symposium on Polymer Surface Modification. p.22-22
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Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes

Sam Siau, Alfons Vervaet (UGent) , S DEGRANDE, Etienne Schacht (UGent) and André Van Calster (UGent)

(2005) APPLIED SURFACE SCIENCE. 245(1-4). p.353-368
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Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards

Sam Siau, Johan De Baets (UGent) , André Van Calster (UGent) , L HEREMANS and Sofie Tanghe

(2005) MICROELECTRONICS RELIABILITY. 45(3-4). p.675-687
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Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , S DEGRANDE, Katrien Callewaert and André Van Calster (UGent)

(2005) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 152(9).

Academic Bibliography

XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments

Study of the failure mechanism of the Cu/epoxy interface after modifications by means of surface chemical reactions

Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics

Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper

The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper

Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes

Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards

Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

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