Ghent University Academic Bibliography

Your filters: cql: author="Schols, G" or (type any "bookEditor issueEditor" and editor="Schols, G")

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- Journal Article
- A1
- open access
Machine learning risk prediction of mortality for patients undergoing surgery with perioperative SARS-CoV-2 : the COVIDSurg mortality score

[missing] COVIDSurg Collaborative, I Dajti, J I Valenzuela, L A Boccalatte, N A Gemelli, D E Smith, N N Dudi-Venkata, H M Kroon, T Sammour, M Roberts, et al.

(2021) BRITISH JOURNAL OF SURGERY. 108(11). p.1274-1292
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- Conference Paper
- C3
- open access
PoCOsteo : PoC in-office device for identifying individuals at high risk of osteoporosis and osteoporotic fracture

Patricia Khashayar (UGent) , Frederik Leys (UGent) , Paula Dias Lopes Campos (UGent) , A Ostovar, G Schols, R Gransee, D Latta, P Biggs, IJ Riley, CK O'Sullivan, et al.

(2018) OSTEOPOROSIS INTERNATIONAL. 29(suppl. 1). p.S280-S280
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- Conference Paper
- C1
Design, Fabrication and Bumping of Test Chips for Development of Fine Pitch Flip-Chip Technologies.

Jan Vanfleteren (UGent) , Johan De Baets (UGent) , André Van Calster (UGent) , G SCHOLS, N PERGOOT, E JARVINEN and A AINTILA

(1999) Proceedings of the 12th European Microelectronics & Packaging Conference, Imaps-Europe, Harrogate, juni 1999. p.399-404
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- Miscellaneous
A five-layer thin film MCM-Si design using oxynitride dielectrics

Jo Lernout, Jan Vanfleteren (UGent) , André Van Calster (UGent) and G Schols

(1998) Microelectronics International, Vol. 15, No. 1, januari. p.39-42
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- Conference Paper
- C1
A Five Layer Thin Film MCM-Si Design using Oxynitride Dielectrics

Jo Lernout, Jan Vanfleteren (UGent) , André Van Calster (UGent) and G SCHOLS

(1997) Proceedings of the 11th European Microelectronics Conference, Venice, Italy, mei. p.637-640
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- Conference Paper
- C1
On the Effective Integration of Resistors and Capacitors into a MCM-Si Design

Jo Lernout, André Van Calster (UGent) and G SCHOLS

(1996) Proceedings of the 1996 Internatioanl Conference on Multichip Modules, Denver, Colorado, april. p.391-396
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- Miscellaneous
A Low-Cost TAB Interconnection technology for LCD Drivers

A Dravet, P Kertesz, S Sechez, André Van Calster (UGent) , Jan Vanfleteren (UGent) , M Decaluwe, K Deckelmann, J Wiese and G Schols

(1996) Digest of Technical papers, Vol. 27, SID, San Diego, California, mei. p.925-928
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- Conference Paper
- C1
Development of an adhesive TAB joining technology

Jan Vanfleteren (UGent) , André Van Calster (UGent) , Kris Sabbe, M DE CALUWE, A DRAVET, P KERTESZ, S SECHER, K DECKELMANN, J WIESE, E CORTES, et al.

(1996) Proceeding of the European Conference on Electronic Packaging Technology, Vol. 173, Deutscher Verband für Schweisstechnik (DVS), Essen, Germany, januari. p.24-26
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- Conference Paper
- C1
Two Layer Silicon Hybrids Interconnect Technology

J LERNOUT, André Van Calster (UGent) , M VEREECKEN and G SCHOLS

(1995) Proceedings of 1995 International Conference on Multichip Modules, Denver, april. p.375-380
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- Conference Paper
- C1
Two Layer Silicon Hybrid Interconnect

J LERNOUT, André Van Calster (UGent) , M VEREECKEN and G SCHOLS

(1995) Proceedings of the 10th European Microelectronics Conference, Copenhagen, mei. p.162-171

Academic Bibliography

Machine learning risk prediction of mortality for patients undergoing surgery with perioperative SARS-CoV-2 : the COVIDSurg mortality score

PoCOsteo : PoC in-office device for identifying individuals at high risk of osteoporosis and osteoporotic fracture

Design, Fabrication and Bumping of Test Chips for Development of Fine Pitch Flip-Chip Technologies.

A five-layer thin film MCM-Si design using oxynitride dielectrics

A Five Layer Thin Film MCM-Si Design using Oxynitride Dielectrics

On the Effective Integration of Resistors and Capacitors into a MCM-Si Design

A Low-Cost TAB Interconnection technology for LCD Drivers

Development of an adhesive TAB joining technology

Two Layer Silicon Hybrids Interconnect Technology

Two Layer Silicon Hybrid Interconnect

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