Ghent University Academic Bibliography

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Semi-analytical model for electrically injected GaAs nano-ridge laser diodes monolithically integrated on silicon

Andualem Ali Yimam (UGent) , Davide Colucci (UGent) , Charles Caer, Didit Yudistira, Yannick DE Koninck, Huseyin Sar, Marina Baryshnikova, Peter Verheyen, Joris VAN Campenhout, Bernardette Kunert, et al.

(2025) OPTICS EXPRESS. 33(2). p.2101-2114
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Low-loss integration of high-density polymer waveguides with silicon photonics for co-packaged optics

Jef Van Asch (UGent) , Jeroen Missinne (UGent) , Junwen He, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Huseyin Sar, Hakim Kobbi, Swetanshu Bipul, et al.

(2025) OPTICA. 12(6). p.821-830
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GaAs nano-ridge laser diodes fully fabricated in a 300-mm CMOS pilot line

Yannick De Koninck, Charles Caer, Didit Yudistira, Marina Baryshnikova, Huseyin Sar, Ping-Yi Hsieh, Cenk Ibrahim Oezdemir, Saroj Kanta Patra, Nadezda Kuznetsova, Davide Colucci (UGent) , et al.

(2025) NATURE. 637(8044).
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Sub-1 dB loss SiN-to-polymer waveguide coupling : an enabler for co-packaged optics

Jef Van Asch (UGent) , Jeroen Missinne (UGent) , Junwen He, Pengfei Xu, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Huseyin Sar, Hakim Kobbi, et al.

(2024) Optical Fiber Communication Conference (OFC) 2024.
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Wafer-scale hybrid integration of InP DFB lasers on Si photonics by flip-chip bonding with sub-300nm alignment precision

Aleksandrs Marinins, Sebastian Hansch, Huseyin Sar, Francois Chancerel, Negin Golshani, Hsiao-Lun Wang, Artemisia Tsiara, David Coenen, Peter Verheyen, Giovanni Capuz, et al.

(2023) IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS. 29(3).

Academic Bibliography

Semi-analytical model for electrically injected GaAs nano-ridge laser diodes monolithically integrated on silicon

Low-loss integration of high-density polymer waveguides with silicon photonics for co-packaged optics

GaAs nano-ridge laser diodes fully fabricated in a 300-mm CMOS pilot line

Sub-1 dB loss SiN-to-polymer waveguide coupling : an enabler for co-packaged optics

Wafer-scale hybrid integration of InP DFB lasers on Si photonics by flip-chip bonding with sub-300nm alignment precision

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