Ghent University Academic Bibliography

Your filters: cql: author="Napieralski, Andrzej" or (type any "bookEditor issueEditor" and editor="Napieralski, Andr...

Add to list
The electric energy stored in PEDOT:PSS capacitors integrated on textile substrate : limits and possibilities

Sheilla Atieno Odhiambo (UGent) , Piotr Fiszer, Gilbert De Mey (UGent) , Carla Hertleer (UGent) , Ida Nuramdhani, Lieva Van Langenhove (UGent) and Andrzej Napieralski

(2018) INTERNATIONAL JOURNAL OF CLOTHING SCIENCE AND TECHNOLOGY. 30(6). p.808-816
Add to list
Influence of dry cleaning on the electrical resistance of screen printed conductors on textiles

Ilda Kazani (UGent) , Gilbert De Mey (UGent) , R Klepacko, Carla Hertleer (UGent) , Genti Guxho, Lieva Van Langenhove (UGent) and Andrzej Napieralski

(2016) AUTEX RESEARCH JOURNAL. 16(3). p.146-153
Add to list
Use of electric energy stored in a textile-based PEDOT:PSS capacitor

Sheilla Atieno Odhiambo (UGent) , Carla Hertleer (UGent) , Lieva Van Langenhove (UGent) , Gilbert De Mey (UGent) , Piotr Fiszer and Andrzej Napieralski

(2015) 2015 22ND INTERNATIONAL CONFERENCE MIXED DESIGN OF INTEGRATED CIRCUITS & SYSTEMS (MIXDES). p.515-517
Add to list
- Journal Article
- A1
- open access
Influence of lateral heat diffusion on the thermal impedance measurements of photovoltaic panels

Gilbert De Mey (UGent) , Jaroslaw Wyrzutowicz, Alexis De Vos (UGent) , Witold Maranda and Andrzej Napieralski

(2013) SOLAR ENERGY MATERIALS AND SOLAR CELLS. 112. p.1-5
Add to list
Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses

Marcin Janicki, Jedrzej Banaszczyk, Bjorn Vermeersch, Gilbert De Mey (UGent) and Andrzej Napieralski

(2011) MICROELECTRONICS RELIABILITY. 51(8). p.1351-1355
Add to list
- Journal Article
- A1
- open access
Heat dissipation and temperature distribution in long interconnect lines

katarzyna Gnidzinska, Gilbert De Mey (UGent) and Andrzej Napieralski

(2010) BULLETIN OF THE POLISH ACADEMY OF SCIENCES-TECHNICAL SCIENCES. 58(1). p.119-124
Add to list
Dynamic thermal modelling of a power integrated circuit with the application of structure functions

Marcin Janicki, Jedrzej Banaszczyk (UGent) , Gilbert De Mey (UGent) , Marek Kaminski, Bjorn Vermeersch (UGent) and Andrzej Napieralski

(2009) MICROELECTRONICS JOURNAL. 40(7). p.1135-1140
Add to list
- Conference Paper
- P1
Assessment of die attach quality by analysis of circuit thermal response spectrum

Marcin Janicki, Bjorn Vermeersch (UGent) , Jedrzej Banaszczyk (UGent) , Marec Kaminski, Gilbert De Mey (UGent) and Andrzej Napieralski

(2008) 14TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATION OF ICS AND SYSTEMS. p.43-46
Add to list
- Conference Paper
- P1
Determining thermal simulation data from transient measurements

Marcin Janicki, Stefan Kinderman, Piotr Pietrzak, Bjorn Vermeersch (UGent) , Jedrzej Banaszczyk (UGent) , Gilbert De Mey (UGent) and Andrzej Napieralski

(2008) TWENTY FOURTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2008. p.200-204
Add to list
- Conference Paper
- C1
Chimney effect on natural convection cooling of electronic components

Bjorn Vermeersch (UGent) , Gilbert De Mey (UGent) , M. Wojcik, J. Pilarski, M. Lasota, Jedrzej Banaszczyk (UGent) , Andrzej Napieralski and Michel De Paepe (UGent)

(2008) p.1-6

Academic Bibliography

The electric energy stored in PEDOT:PSS capacitors integrated on textile substrate : limits and possibilities

Influence of dry cleaning on the electrical resistance of screen printed conductors on textiles

Use of electric energy stored in a textile-based PEDOT:PSS capacitor

Influence of lateral heat diffusion on the thermal impedance measurements of photovoltaic panels

Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses

Heat dissipation and temperature distribution in long interconnect lines

Dynamic thermal modelling of a power integrated circuit with the application of structure functions

Assessment of die attach quality by analysis of circuit thermal response spectrum

Determining thermal simulation data from transient measurements

Chimney effect on natural convection cooling of electronic components

Contents

Support

Contact