Ghent University Academic Bibliography

Your filters: cql: author="Napieralski, A" or (type any "bookEditor issueEditor" and editor="Napieralski, A")

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Analysis of nonlinear heat exchange phenomena in natural convection cooled electronics systems

Gilbert De Mey (UGent) , T Torzewicz, P Kawka, A Czewoniec, M Janicki and A Napieralski

(2016) MICROELECTRONICS RELIABILITY. 67. p.15-20
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Influence of interface materials on the thermal impedance of electronic packages

Gilbert De Mey (UGent) , J Pilarski, M Wojcik, M Lasota, Jedrzej Banaszczyk (UGent) , Bjorn Vermeersch (UGent) and A Napieralski

(2009) INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER. 36(3). p.210-212
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- Journal Article
- A1
Chimney effect on natural convection cooling of a transistor mounted on a cooling fin

Gilbert De Mey (UGent) , M Wojcik, J Pilarski, M Lasota, J Banaszczyk, Bjorn Vermeersch (UGent) , A Napieralski and Michel De Paepe (UGent)

(2009) JOURNAL OF ELECTRONIC PACKAGING. 131(1).
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- Conference Paper
- C1
- open access
Application of structure functions for the investigation of forced air cooling

M JANICKI, Jedrzej Banaszczyk (UGent) , Gilbert De Mey (UGent) , M KAMINSKI, Bjorn Vermeersch (UGent) and A NAPIERALSKI

(2007) Proceedings of the 13th International Conference on Thermal Investigations of ICs and Systems (THERMINIC 2007). p. 2-5 2007. p.2-5
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- Conference Paper
- C1
- open access
Dynamic thermal analysis of a power amplifier

Jedrzej Banaszczyk (UGent) , Gilbert De Mey (UGent) , M JANICKI, A NAPIERALSKI, Bjorn Vermeersch (UGent) and P KAWKA

(2006) Proceedings of the 12th International Workshop on Thermal Investigation of ICs and Systems (Therminic 2006). 1. p.128-132
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- Journal Article
- A2
Pomier termiznego stanu przejsciowego jako metoda obliczania aktywnej powierzchni krzemu

P KAWKA, Gilbert De Mey (UGent) and A NAPIERALSKI

(2004) Elektronika. 2004. p.33-35
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- Conference Paper
- C1
Electronic Package Thermal Description By Dielectric Polarization Theory

Piotr Kawka, Gilbert De Mey (UGent) and A NAPIERALSKI

(2004) Proceedings of the 11th International Conference Mixed Design of Integrated Circuits and Systems MIXDES 2004. p.287-290
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- Conference Paper
- C1
Transient Thermal Measurement as a Tool for Packages Thermal Description

Piotr Kawka, Gilbert De Mey (UGent) and A NAPIERALSKI

(2003) ANCME 2003 The 2nd International Workshop on Advances in Numerical Computation Methods in Electromagnetism. p.53-58
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- Conference Paper
- C1
Transient Thermal Measurement for Silicon Active Area Calculations

Piotr Kawka, Gilbert De Mey (UGent) and A NAPIERALSKI

(2003) Proceedings of the 10th International Conference Mixed Design of Integrated Circuits and Systems MIXDES. p.383-386
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- Conference Paper
- C1
Transient thermal measurement as a non-invasive method for electronic chip layout investigation

Piotr Kawka, Gilbert De Mey (UGent) and A NAPIERALSKI

(2003) 6th National Congress on Theoretical and Applied Mechanics.

Academic Bibliography

Analysis of nonlinear heat exchange phenomena in natural convection cooled electronics systems

Influence of interface materials on the thermal impedance of electronic packages

Chimney effect on natural convection cooling of a transistor mounted on a cooling fin

Application of structure functions for the investigation of forced air cooling

Dynamic thermal analysis of a power amplifier

Pomier termiznego stanu przejsciowego jako metoda obliczania aktywnej powierzchni krzemu

Electronic Package Thermal Description By Dielectric Polarization Theory

Transient Thermal Measurement as a Tool for Packages Thermal Description

Transient Thermal Measurement for Silicon Active Area Calculations

Transient thermal measurement as a non-invasive method for electronic chip layout investigation

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