Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Save this search Download search results Subscribe to news feed Your filters: cql: author="Lu, Hai-Sheng" or (type any "bookEditor issueEditor" and editor="Lu, Hai-Sheng") Add to list Journal Article A1 Improved thermal stability and electrical performance by using PEALD ultrathin Al2O3 film with Ta as Cu diffusion barrier on low k dielectrics Shao-Feng Ding, Qi Xie (UGent) , Fei Chen, Hai-Sheng Lu, Shaoren Deng (UGent) , Davy Deduytsche (UGent) , Christophe Detavernier (UGent) and Xin-Ping Qu (2012) ECS SOLID STATE LETTERS. 1(3). p.P54-P56 Add to list Journal Article A1 The inhibition of enhanced Cu oxidation on ruthenium/diffusion barrier layers for Cu interconnects by carbon alloying into Ru Shao-Feng Ding, Qi Xie (UGent) , Steve Müeller, Thomas Waechtler, Hai-Sheng Lu, Stefan E Schulz, Christophe Detavernier (UGent) , Xin-Ping Qu and Thomas Gessner (2011) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 158(12). p.H1228-H1232 Add to list Conference Paper P1 open access Investigation of ultra-thin Al₂O₃ film as Cu diffusion barrier on low-k (k=2.5) dielectrics Shao-Feng Ding, Qi Xie (UGent) , Fei Chen, Hai-Sheng Lu, Shao-Ren Deng, Christophe Detavernier (UGent) , Guo-Ping Ru, Yu-Long Jiang and Xin-Ping Qu (2011) 2011 IEEE international interconnect technology conference and materials for advanced metallization (IITC/MAM).