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- Conference Paper
- C1
- open access
Hybrid integration on low-cost flex foils using photonic flash soldiering
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Stretchable passive matrix LED display with thin-film based interconnects
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- Conference Paper
- C1
- open access
A conformable active matrix LED display
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- Conference Paper
- C1
- open access
Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications
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Photonic flash soldering of thin chips and SMD components on foils for flexible electronics
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Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending
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Large area flexible lighting foils using distributed bare LED dies on polyester substrates
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- Conference Paper
- C1
- open access
Active and passive component embedding into low-cost plastic substrates aimed at smart system applications
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Integration techniques and applications of thin chips on low cost foil substrates
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High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies