Show
Sort by
-
Analysis of nonlinear heat exchange phenomena in natural convection cooled electronics systems
-
Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance
-
Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance
-
- Conference Paper
- C1
- open access
Dynamic thermal analysis of a power amplifier
-
Thermal impedance simulations of electronic packages
-
Pomier termiznego stanu przejsciowego jako metoda obliczania aktywnej powierzchni krzemu
-
Electronic Package Thermal Description By Dielectric Polarization Theory
-
Transient Thermal Measurement as a Tool for Packages Thermal Description
-
Transient Thermal Measurement for Silicon Active Area Calculations
-
Transient thermal measurement as a non-invasive method for electronic chip layout investigation