Ghent University Academic Bibliography

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The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects

Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt (UGent) , Fabrice Axisa, Jan Vanfleteren (UGent) and Ingrid De Wolf

(2011) THIN SOLID FILMS. 519(7). p.2225-2234
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- Conference Paper
- C3
Reliability assessment of stretchable interconnects

Yung Yu Hsu, B Dimcic, Mario Gonzalez, Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) and Ingrid De Wolf

(2010) Microsystems, Packaging, Assembly and Circuits technology conference, 5th International, Abstracts.
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The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit

Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt (UGent) , Fabrice Axisa (UGent) , Jan Vanfleteren (UGent) and Ingrid De Wolf

(2010) JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 20(7).
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Design and analysis of a novel fine pitch and highly stretchable interconnect

Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt (UGent) , Fabrice Axisa (UGent) , Jan Vanfleteren (UGent) , Bart Vandevelde and Ingrid De Wolf

(2010) MICROELECTRONICS INTERNATIONAL. 27(1). p.33-38
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- Conference Paper
- C1
- open access
Thermo-mechanical analysis of flexible and stretchable systems

Mario Gonzalez, Bart Vandevelde, Wim Christiaens (UGent) , Yung Yu Hsu, Francois Iker, Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) , Olaf Van der Sluis and Pieter Timmermans

(2010) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 11th International conference, Proceedings.
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Design and performance of metal conductors for stretchable electronic circuits

Mario Gonzalez, Fabrice Axisa (UGent) , Frederick Bossuyt (UGent) , Yung Yu Hsu, Bart Vandevelde and Jan Vanfleteren (UGent)

(2009) CIRCUIT WORLD. 35(1). p.22-29

Academic Bibliography

The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects

Reliability assessment of stretchable interconnects

The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit

Design and analysis of a novel fine pitch and highly stretchable interconnect

Thermo-mechanical analysis of flexible and stretchable systems

Design and performance of metal conductors for stretchable electronic circuits

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