Show
Sort by
-
Reconfigurable topologies for smarter PV modules: simulation, evaluation and implementation
-
Single NDMOS integrated smart bypass for partial shading power loss reduction
-
- Journal Article
- A1
- open access
Developing an advanced module for back-contact solar cells
-
Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology
-
Performance of a new type of module based on back-contact solar cells
-
Technology Development and Characterization forInterconnecting Driver Electronic Circuitry to Flat-PanelDisplays.
(2009) -
Ultra thin chip packaging (UTCP): a promising technology for future flexible display interconnection
-
Fabrication processes for embedding thin chips in flat flexible substrates
-
Assembly of Ultra-Thin Chip Packages (UTCPs) for enhanced flexibility of flexible displays
-
Interconnecting drivers to flexible displays
-
- Conference Paper
- P1
- open access
Multiple chip integration for flat flexible electronics
-
Embedding of thinned chips in plastic substrates
-
Advanced Technologies in Fabrication and Interconnection of Flexible Displays and Substrates