Ghent University Academic Bibliography

Your filters: cql: author="Franquet, Alexis" or (type any "bookEditor issueEditor" and editor="Franquet, Alexis")

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- Journal Article
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Atomic layer deposition of ruthenium dioxide based on redox reactions between alcohols and ruthenium tetroxide

Nithin Poonkottil (UGent) , Matthias Minjauw (UGent) , Andreas Werbrouck (UGent) , Stefano Checchia, Eduardo Solano, Mikko Nisula (UGent) , Alexis Franquet, Christophe Detavernier (UGent) and Jolien Dendooven (UGent)

(2022) CHEMISTRY OF MATERIALS. 34(19). p.8946-8958
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- Journal Article
- A1
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Efficient long-range conduction in cable bacteria through nickel protein wires

Henricus T. S. Boschker, Perran L. M. Cook, Lubos Polerecky, Raghavendran Thiruvallur Eachambadi, Helena Lozano, Silvia Hidalgo-Martinez, Dmitry Khalenkow, Valentina Spampinato, Nathalie Claes, Paromita Kundu, et al.

(2021) NATURE COMMUNICATIONS. 12(1).
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UV cure of oxycarbosilane low-k films

Murad Redzheb (UGent) , Lutz Prager, Mikhail Krishtab, Silvia Armini, Kris Vanstreels, Alexis Franquet, Pascal Van Der Voort (UGent) and Mikhail R Baklanov

(2016) MICROELECTRONIC ENGINEERING. 156. p.103-107
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- Conference Paper
- P1
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Impact of UV wavelength and curing time on the properties of spin-coated low-k films

M Rhedzeb, L Prager, M Krishtab, S Armini, K Vanstreels, Alexis Franquet, Pascal Van Der Voort (UGent) and MR Baklanov

(2015) 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM). p.99-101
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Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films

Yiting Sun, Elisabeth Levrau, Liping Zhang, Jef Geypen, Johan Meersschaut, Alexis Franquet, Quoc Le Le, Jean-François de Marneffe, Hugo Bender, Herbert Struyf, et al.

(2015) MICROELECTRONIC ENGINEERING. 137. p.70-74
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Metal-insulator transition in ALD VO2 ultrathin films and nanoparticles: morphological control

Anthony P Peter, Koen Martens, Geert Rampelberg (UGent) , Michael Toeller, James M Ablett, Johan Meersschaut, Daniel Cuypers, Alexis Franquet, Christophe Detavernier (UGent) , Jean-Pascal Rueff, et al.

(2015) ADVANCED FUNCTIONAL MATERIALS. 25(5). p.679-686
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Influence of carbon content on the copper-telluride phase formation and on the resistive switching behavior of carbon alloyed Cu-Te conductive bridge random access memory cells

Wouter Devulder (UGent) , Karl Opsomer (UGent) , Alexis Franquet, Johan Meersschaut, Attilio Belmonte, Robert Muller, Bob De Schutter (UGent) , Sven Van Elshocht, Malgorzata Jurczak, Ludovic Goux, et al.

(2014) JOURNAL OF APPLIED PHYSICS. 115(5).
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Three-dimensional observation of the conductive filament in nanoscaled resistive memory devices

Umberto Celano, Ludovic Goux, Attilio Belmonte, Karl Opsomer, Alexis Franquet, Andreas Schulze, Christophe Detavernier (UGent) , Olivier Richard, Hugo Bender, Malgorzata Jurczak, et al.

(2014) NANO LETTERS. 14(5). p.2401-2406
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Seed layer and multistack approaches to reduce leakage in SrTiO3-based metal-insulator-metal capacitors using TiN bottom electrode

Nicolas Menou, Mihaela Popovici, Karl Opsomer, Ben Kaczer, Malgorzata A Pawlak, Christoph Adelmann, Alexis Franquet, Paola Favia, Hugo Bender, Christophe Detavernier (UGent) , et al.

(2010) JAPANESE JOURNAL OF APPLIED PHYSICS. 49(4).

Academic Bibliography

Atomic layer deposition of ruthenium dioxide based on redox reactions between alcohols and ruthenium tetroxide

Efficient long-range conduction in cable bacteria through nickel protein wires

UV cure of oxycarbosilane low-k films

Impact of UV wavelength and curing time on the properties of spin-coated low-k films

Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films

Metal-insulator transition in ALD VO2 ultrathin films and nanoparticles: morphological control

Influence of carbon content on the copper-telluride phase formation and on the resistive switching behavior of carbon alloyed Cu-Te conductive bridge random access memory cells

Three-dimensional observation of the conductive filament in nanoscaled resistive memory devices

Seed layer and multistack approaches to reduce leakage in SrTiO3-based metal-insulator-metal capacitors using TiN bottom electrode

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