Ghent University Academic Bibliography

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Solar cells integration in over-molded printed electronics

Mona Bakr (UGent) , Pieter Bauwens (UGent) , Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) , Imen Chtioui and Wim Christiaens

(2020) 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), Proceedings.
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Metaphysics and cinema

Wim Christiaens (UGent)

(2012) Worldviews, science and us : bridging knowledge and its implications for our perspectives of the world. p.118-141
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- Conference Paper
- P1
- open access
Embedding thinned chips in flexible PCBs

Tom Sterken (UGent) , Filip Vermeiren (UGent) , Piers Tremlett, Wim Christiaens and Jan Vanfleteren (UGent)

(2012) ESTC 2012 : 4th electronics system integration technologies conference.
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- Book Chapter
System-in-foil technology

Andreas Dietzel, Jeroen van den Brand, Jan Vanfleteren (UGent) , Wim Christiaens (UGent) , Erwin Bosman (UGent) and Johan De Baets (UGent)

(2011) Ultra-thin chip technology and applications. p.141-157
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3D-stacking of UTCPs as a module miniaturization technology

Swarnakamal Priyabadini (UGent) , An Gielen (UGent) , Kristof Dhaenens (UGent) , Wim Christiaens (UGent) , Steven Van Put (UGent) , Gerhard Kunkel, Anders Erik Petersen and Jan Vanfleteren (UGent)

(2011) 44th International Symposium on Microelectronics, Proceedings. p.463-468
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Design and implementation of flexible and stretchable systems

Mario Gonzalez, Bart Vandevelde, Wim Christiaens (UGent) , Yung-Yu Hsu, François Iker, Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) , Olaf van der Sluis and PHM Timmermans

(2011) MICROELECTRONICS RELIABILITY. 51(6). p.1069-1076
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- Conference Paper
- C3
A Reliable and comfortable package for wearable medical devices

Tom Sterken (UGent) , Jan Vanfleteren (UGent) , Frederick Bossuyt (UGent) , Steven Brebels, Wim Christiaens (UGent) , Thomas Vervust (UGent) , Michal Jablonski (UGent) , Sheila Dunphy (UGent) , Filip Vermeiren (UGent) , Yung-yu Hsu, et al.

(2011) Microelectronic packaging for medical and Hi-Rel devices, Abstracts.
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UTCP: a novel polyimide-based ultra-thin chip packaging technology

Wim Christiaens (UGent) , Erwin Bosman (UGent) and Jan Vanfleteren (UGent)

(2010) IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. 33(4). p.754-760
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Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

Jonathan Govaerts (UGent) , Erwin Bosman (UGent) , Wim Christiaens (UGent) and Jan Vanfleteren (UGent)

(2010) IEEE TRANSACTIONS ON ADVANCED PACKAGING. 33(1). p.72-78
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Module miniaturization by ultra thin package stacking

Thomas Loeher, David Schuetze, Wim Christiaens (UGent) , Kristof Dhaenens (UGent) , Swarnakamal Priyabadini (UGent) , Andreas Ostmann and Jan Vanfleteren (UGent)

(2010) 2010 3rd electronic system-integration technology conference (ESTC 2010). p.1-5

Academic Bibliography

Solar cells integration in over-molded printed electronics

Metaphysics and cinema

Embedding thinned chips in flexible PCBs

System-in-foil technology

3D-stacking of UTCPs as a module miniaturization technology

Design and implementation of flexible and stretchable systems

A Reliable and comfortable package for wearable medical devices

UTCP: a novel polyimide-based ultra-thin chip packaging technology

Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

Module miniaturization by ultra thin package stacking

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