Ghent University Academic Bibliography

Your filters: cql: author="Beyne, Eric" or (type any "bookEditor issueEditor" and editor="Beyne, Eric")

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Broadband electromagnetic modeling of on-chip passives using a differential surface admittance operator for 3-D piecewise homogeneous structures

Tim Pattyn (UGent) , Xiao Sun, Eric Beyne, Daniël De Zutter (UGent) , Martijn Huynen (UGent) and Dries Vande Ginste (UGent)

(2025) IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 73(12). p.10199-10212
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Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures

Tim Pattyn (UGent) , Xiao Sun, Eric Beyne, Daniël De Zutter (UGent) , Martijn Huynen (UGent) and Dries Vande Ginste (UGent)

(2025) 2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). p.1-3
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RF Si interposer platform for chiplets based heterogenous systems

Xiao Sun, Siddhartha Sinha, Martijn Huynen (UGent) , Reinier Broucke (UGent) , Melina Lofrano, Vladimir Cherman, Hamideh Jafarpoorchekab, Damien Leech, Angel Uruena, Ehsan Shafahian, et al.

(2025) 2025 IEEE 75TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC. In Electronic Components and Technology Conference p.189-196
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Extreme silicon thinning for back side power delivery network : Si thinning stopping on scaled SiGe etch stop layer

Farid Sebaai, Roger Loo (UGent) , Anne Jourdain, Eric Beyne, Hikaru Kawarazaki, Teppei Nakano and Efrain Altamirano Sanchez

(2024) MICROELECTRONIC ENGINEERING. 294.
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Efficient characterization of interconnects with arbitrary polygonal cross sections using fokas-derived Dirichlet-to-Neumann operators

Dries Bosman, Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert van der Plas, Eric Beyne and Dries Vande Ginste (UGent)

(2023) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 13(10). p.1567-1575
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Interconnect modeling using a surface admittance operator derived with the Fokas method

Dries Bosman, Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert Van der Plas, Eric Beyne and Dries Vande Ginste (UGent)

(2022) 2022 IEEE 31ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2022). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS
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Entire domain basis function expansion of the differential surface admittance for efficient broadband characterization of lossy interconnects

Martijn Huynen (UGent) , Kamil Yavuz Kapusuz (UGent) , Xiao Sun, Geert Van der Plas, Eric Beyne, Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2020) IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 68(4). p.1217-1233
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3D heterogeneous package integration of air/magnetic core inductor : 89% efficiency buck converter with backside power delivery network

Xiao Sun, Hesheng Lin, Dimitrios Velenis, John Slabbekoorn, Giacomo Talmelli, Pieter Bex, Tom Sterken (UGent) , Rudy Lauwereins, Christoph Adelmann, Andy Miller, et al.

(2020) 2020 IEEE SYMPOSIUM ON VLSI TECHNOLOGY. In Symposium on VLSI Technology
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Integrated magnetic cores in FOWLP and their applications

Xiao Sun, John Slabbekoorn, Dimitrios Velenis, Pieter Bex, Fabrice Duval, Tom Sterken (UGent) , Giacomo Talmelli, Inge de Preter, Tomas Webers, Christoph Adelmann, et al.

(2020) 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020). In Electronic Components and Technology Conference p.1363-1368

Academic Bibliography

Broadband electromagnetic modeling of on-chip passives using a differential surface admittance operator for 3-D piecewise homogeneous structures

Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures

RF Si interposer platform for chiplets based heterogenous systems

Extreme silicon thinning for back side power delivery network : Si thinning stopping on scaled SiGe etch stop layer

Efficient characterization of interconnects with arbitrary polygonal cross sections using fokas-derived Dirichlet-to-Neumann operators

Interconnect modeling using a surface admittance operator derived with the Fokas method

Entire domain basis function expansion of the differential surface admittance for efficient broadband characterization of lossy interconnects

3D heterogeneous package integration of air/magnetic core inductor : 89% efficiency buck converter with backside power delivery network

Integrated magnetic cores in FOWLP and their applications

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