Show
Sort by
-
Chemical modification of a photo definable epoxy resin with polyamines to improve adhesion with electroless deposited copper
-
Surface modification of a photo definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper
-
Surface modification of an epoxy resin with polyamines via cyanuric chloride coupling
-
Introduction of amino groups on the surface of thin photo definable epoxy resin layers via chemical modification
-
Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics
-
Improvement of copper adhesion by chemical modification of epoxy surfaces.
-
Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper
-
Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics
-
Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper
-
Adhesion strength of the epoxy polymer/copper interface for use in microelectronics