Ghent University Academic Bibliography

Journal Article
A1
open access

Broadband electromagnetic modeling of on-chip passives using a differential surface admittance operator for 3-D piecewise homogeneous structures

Tim Pattyn (UGent) , Xiao Sun, Eric Beyne, Daniël De Zutter (UGent) , Martijn Huynen (UGent) and Dries Vande Ginste (UGent)

(2025) IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 73(12). p.10199-10212

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Conference Paper
C1
open access

Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures

Tim Pattyn (UGent) , Xiao Sun, Eric Beyne, Daniël De Zutter (UGent) , Martijn Huynen (UGent) and Dries Vande Ginste (UGent)

(2025) 2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). p.1-3

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Conference Paper
C3
open access

Spectral analysis of the differential surface admittance electric field integral equation

Martijn Huynen (UGent) , Vladimir Okhmatovski, Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2025) 2025 International Applied Computational Electromagnetics Society Symposium (ACES).

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Conference Paper
P1
open access

Analytic differential admittance operator solution of a dielectric sphere under radial dipole illumination

Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Dries Vande Ginste (UGent) and V. Okhmatovski

(2024) 2024 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, IMS 2024. p.662-665

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Conference Paper
P1
open access

Analytic differential admittance operator for tangential dipole illumination of a dielectric sphere

Martijn Huynen (UGent) , Dries Vande Ginste (UGent) , Daniël De Zutter (UGent) and V. Okhmatovski

(2024) 2024 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION AND INC/USNCURSI RADIO SCIENCE MEETING, AP-S/INC-USNC-URSI 2024. In Digest - IEEE Antennas and Propagation Society. International Symposium (1995. Online) p.1347-1348

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Conference Paper
P1
open access

Accuracy study of the differential surface admittance operator for lossy metal characterization

Martijn Huynen (UGent) , V. Okhmatovksi, Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2024) 2024 IEEE 33RD CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPS 2024. In IEEE Conference on Electrical Performance of Electronic Packaging and Systems p.1-3

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Journal Article
A1
open access

Efficient characterization of interconnects with arbitrary polygonal cross sections using fokas-derived Dirichlet-to-Neumann operators

Dries Bosman, Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert van der Plas, Eric Beyne and Dries Vande Ginste (UGent)

(2023) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 13(10). p.1567-1575

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Journal Article
A1
open access

Analysis and application of a surface admittance operator for combined magnetic and dielectric contrast in emerging interconnect topologies

Dries Bosman, Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert van der Plas, Eric Beyne and Dries Vande Ginste (UGent)

(2023) IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 71(7). p.2794-2806

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Conference Paper
P1
open access

Fokas based dirichlet-to-neumann operators for accurate signal integrity assessment of interconnectse

Martijn Huynen (UGent) , Dries Bosman, Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2023) 2023 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION, NEMO. In International Conference on Numerical Electromagnetic Modeling and Optimization for RF Microwave and Terahertz Applications p.1-4

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Conference Paper
P1
open access

Interconnect modeling using a surface admittance operator derived with the Fokas method

Dries Bosman, Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert Van der Plas, Eric Beyne and Dries Vande Ginste (UGent)

(2022) 2022 IEEE 31ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2022). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS

Academic Bibliography

Broadband electromagnetic modeling of on-chip passives using a differential surface admittance operator for 3-D piecewise homogeneous structures

Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures

Spectral analysis of the differential surface admittance electric field integral equation

Analytic differential admittance operator solution of a dielectric sphere under radial dipole illumination

Analytic differential admittance operator for tangential dipole illumination of a dielectric sphere

Accuracy study of the differential surface admittance operator for lossy metal characterization

Efficient characterization of interconnects with arbitrary polygonal cross sections using fokas-derived Dirichlet-to-Neumann operators

Analysis and application of a surface admittance operator for combined magnetic and dielectric contrast in emerging interconnect topologies

Fokas based dirichlet-to-neumann operators for accurate signal integrity assessment of interconnectse

Interconnect modeling using a surface admittance operator derived with the Fokas method

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