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Improved thermal stability and electrical performance by using PEALD ultrathin Al2O3 film with Ta as Cu diffusion barrier on low k dielectrics
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TaCN growth with PDMAT and H-2/Ar plasma by plasma enhanced atomic layer deposition
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The inhibition of enhanced Cu oxidation on ruthenium/diffusion barrier layers for Cu interconnects by carbon alloying into Ru
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- Conference Paper
- P1
- open access
Investigation of ultra-thin Al₂O₃ film as Cu diffusion barrier on low-k (k=2.5) dielectrics
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ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems