Ghent University Academic Bibliography

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XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments

Sam Siau, B DE ROO and Alfons Vervaet (UGent)

(2007) 211th ECS Meeting - Chicago, Illinois F1 - Electrochemical Processing in ULSI and MEMS 3-Electrodeposition.
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Improvement of copper adhesion by chemical modification of epoxy surfaces.

B DE ROO, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , An Gielen (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) 7e FirW Doctoraatssymposium, papers.
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Study of the failure mechanism of the Cu/epoxy interface after modifications by means of surface chemical reactions

Sam Siau and Alfons Vervaet (UGent)

(2006) ECS Transactions. 3(21). p.123-132
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Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , Ulric Demeter (UGent) and André Van Calster (UGent)

(2006) THIN SOLID FILMS. 495(1-2). p.348-356
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Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Sam Siau, Alfons Vervaet (UGent) , Lieven Degrendele (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) APPLIED SURFACE SCIENCE. 252(8). p.2717-2740

Academic Bibliography

XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments

Improvement of copper adhesion by chemical modification of epoxy surfaces.

Study of the failure mechanism of the Cu/epoxy interface after modifications by means of surface chemical reactions

Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

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