Show 250 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: parent exact "2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2" Add to list Conference Paper P1 open access 3D Integration of ultra-thin functional devices inside standard multilayer flex laminates Wim Christiaens (UGent) , Tom Torfs, Wim Huwel, Chris Van Hoof and Jan Vanfleteren (UGent) (2009) 2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2. p.671-675 Add to list Conference Paper P1 open access A new low cost, elastic and conformable electronics technology for soft and stretchable electronic devices by use of a stretchable substrate Frederick Bossuyt (UGent) , Thomas Vervust (UGent) , Fabrice Axisa (UGent) and Jan Vanfleteren (UGent) (2009) 2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2. p.697-702 Add to list Conference Paper P1 open access Fully embedded optical and electrical interconnections in flexible foils Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Peter Geerinck (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent) (2009) 2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2. p.275-279