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- Conference Paper
- C3
- open access
Technology development for a flexible, low-cost backplane for lighting applications
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- Conference Paper
- C3
- open access
Technology development for a flexible, low-cost backplane for lighting applications
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Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending
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- Conference Paper
- C1
- open access
Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications
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- Conference Paper
- P1
- open access
Flexible and stretchable electronics for wearable healthcare
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- Conference Paper
- C1
- open access
Active and passive component embedding into low-cost plastic substrates aimed at smart system applications
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Integration techniques and applications of thin chips on low cost foil substrates
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High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
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- Conference Paper
- P1
- open access
Towards reel-to-reel integration of ultra thin chips to polymer foils
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- Conference Paper
- P1
- open access
Novel methodology to integrate ultra-thin chips on flexible foils
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- Conference Paper
- P1
- open access
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels