Show 15 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: parent exact "Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibi... Add to list Conference Paper C1 Low temperatue flip-chip assembly for biomedical applications. Jan Vanfleteren (UGent) , B VANDECASTEELE, Tomas Podprocky (UGent) and P JACOBS (2001) Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition, Strasbourg (France), 2001. p.213-216