Show 15 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: parent exact "INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER" Add to list Journal Article A1 Influence of interface materials on the thermal impedance of electronic packages Gilbert De Mey (UGent) , J Pilarski, M Wojcik, M Lasota, Jedrzej Banaszczyk (UGent) , Bjorn Vermeersch (UGent) and A Napieralski (2009) INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER. 36(3). p.210-212