Show 15 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: parent exact "2019 ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS 2019)" Add to list Conference Paper P1 Reduction of common-mode noise in bent differential interconnects for PAM4 signaling Andries Deroo, Martijn Huynen (UGent) , Hendrik Rogier (UGent) , Quinten Van den Brande (UGent) , Dries Vande Ginste (UGent) , Hao-Wei Chan and Ruey-Beei Wu (2019) 2019 ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS 2019). In Electrical Design of Advanced Packaging and Systems Symposium p.1-3