Ghent University Academic Bibliography

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XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments

Sam Siau, B DE ROO and Alfons Vervaet (UGent)

(2007) 211th ECS Meeting - Chicago, Illinois F1 - Electrochemical Processing in ULSI and MEMS 3-Electrodeposition.
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Improvement of copper adhesion by chemical modification of epoxy surfaces.

B DE ROO, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , An Gielen (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) 7e FirW Doctoraatssymposium, papers.
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Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , Ulric Demeter (UGent) and André Van Calster (UGent)

(2006) THIN SOLID FILMS. 495(1-2). p.348-356
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Study of the failure mechanism of the Cu/epoxy interface after modifications by means of surface chemical reactions

Sam Siau and Alfons Vervaet (UGent)

(2006) ECS Transactions. 3(21). p.123-132
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Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics

Alfons Vervaet (UGent) , Sam Siau, Johan De Baets (UGent) and Boniface Manirambona (UGent)

(2006) APPLIED SURFACE SCIENCE. 252(23). p.8243-8250
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Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Sam Siau, Alfons Vervaet (UGent) , Lieven Degrendele (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) APPLIED SURFACE SCIENCE. 252(8). p.2717-2740
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Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) and André Van Calster (UGent)

(2005) Meeting abstracts of the 207th Meeting 2005 The Electrochemical Society.. p.348-348
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The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper

Sam Siau, Alfons Vervaet (UGent) , André Van Calster (UGent) and Daniël Baert

(2005) Program of the Fifth International Symposium on Polymer Surface Modification. p.22-22
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Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

SABINE SIAU (UGent) , Alfons Vervaet (UGent) , André Van Calster (UGent) , Etienne Schacht (UGent) and Ulric Demeter (UGent)

(2005) Proceedings E-MRS 2005 Spring Meeting Strassbourg. p.E37-E38
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Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

Sam Siau, Alfons Vervaet (UGent) , L VAN VAECK, Etienne Schacht (UGent) , Ulric Demeter (UGent) and André Van Calster (UGent)

(2005) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 152(6).
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Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes

Sam Siau, Alfons Vervaet (UGent) , S DEGRANDE, Etienne Schacht (UGent) and André Van Calster (UGent)

(2005) APPLIED SURFACE SCIENCE. 245(1-4). p.353-368
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Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , S DEGRANDE, Katrien Callewaert and André Van Calster (UGent)

(2005) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 152(9).
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A fast method for the measurement of the electrical capacitance for the estimation of battery capacity

Daniël Baert and Alfons Vervaet (UGent)

(2004) IEICE TRANSACTIONS ON COMMUNICATIONS. E87B(12). p.3478-3484
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Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as a build-up layer

Sam Siau, Alfons Vervaet (UGent) , André Van Calster (UGent) , Ives Swennen (UGent) and Etienne Schacht (UGent)

(2004) APPLIED SURFACE SCIENCE. 237(1-4). p.456-461
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Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers : I. Sweller influence

Sam Siau, Alfons Vervaet (UGent) , Sylvie Nalines, Etienne Schacht (UGent) and André Van Calster (UGent)

(2004) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 151(12). p.C816-C830

Academic Bibliography

XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments

Improvement of copper adhesion by chemical modification of epoxy surfaces.

Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Study of the failure mechanism of the Cu/epoxy interface after modifications by means of surface chemical reactions

Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics

Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper

The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper

Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes

Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

A fast method for the measurement of the electrical capacitance for the estimation of battery capacity

Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as a build-up layer

Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers : I. Sweller influence

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