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- Conference Paper
- C1
- open access
Hybrid integration on low-cost flex foils using photonic flash soldiering
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Stretchable passive matrix LED display with thin-film based interconnects
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Flexible and stretchable electronics for wearable health devices
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Stretchable 45 x 80 RGB LED display using meander wiring technology
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- Conference Paper
- C1
- open access
A conformable active matrix LED display
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- Conference Paper
- C1
- open access
Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications
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Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending
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Photonic flash soldering of thin chips and SMD components on foils for flexible electronics
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- Conference Paper
- P1
- open access
Flexible and stretchable electronics for wearable healthcare
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Large area flexible lighting foils using distributed bare LED dies on polyester substrates
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- Conference Paper
- C1
- open access
Active and passive component embedding into low-cost plastic substrates aimed at smart system applications
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Integration techniques and applications of thin chips on low cost foil substrates
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Stretchable circuits with horseshoe shaped conductors: embedded in elastic polymers
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High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
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Reliable filling of through vias with silver based conductive adhesives in flexible PEN substrates using low-cost optimized stencil printing methods
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- Conference Paper
- P1
- open access
Bonding bare die LEDs on PET foils for lighting applications: thermal design modeling and bonding experiments
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- Conference Paper
- P1
- open access
Novel methodology to integrate ultra-thin chips on flexible foils
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- Conference Paper
- P1
- open access
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
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- Conference Paper
- C1
- open access
Flipchip bonding of thin Si dies onto PET foils: possibilities and applications
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System-in-foil technology
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- Conference Paper
- C1
- open access
Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils
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Mechanistic aspects of selective laser patterning of multilayered thin-film structures in OLED fabrication
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A comparative study of via drilling and scribing on PEN and PET substrates for flexible electronic applications using excimer and Nd:YAG laser sources