Show 100 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: author="Su, Yibo" or (type any "bookEditor journalEditor issueEditor" and editor="Su, Yibo") Add to list Conference Paper C1 open access Over-molding of two-dimensional curved shape using polyimide copper cladding foil Mona Bakr (UGent) , Yibo Su, Ali Rezaei, Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent) (2021) 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). Add to list Journal Article A1 Over-molding of flexible polyimide-based electronic circuits Mona Bakr (UGent) , Yibo Su, Ali Rezaei, Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent) (2021) FLEXIBLE AND PRINTED ELECTRONICS. 6(2). Add to list Conference Paper P1 open access Flexible microsystems using over-molding technology Mona Bakr (UGent) , Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) and Yibo Su (2020) PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SYSTEM-INTEGRATED INTELLIGENCE (SYSINT 2020) : SYSTEM-INTEGRATED INTELLIGENCE - INTELLIGENT, FLEXIBLE AND CONNECTED SYSTEMS IN PRODUCTS AND PRODUCTION. In Procedia Manufacturing 52. p.26-31 Add to list Conference Paper P1 open access Effect of overmolding process on the integrity of electronic circuits Mona Bakr (UGent) , Yibo Su, Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent) (2019) 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). In European Microelectronics Packaging Conference