Ghent University Academic Bibliography

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Selective electroless deposition of cobalt using amino-terminated SAMs

Ivan Zyulkov, Silvia Armini, Karl Opsomer, Christophe Detavernier (UGent) and Stefan De Gendt

(2019) JOURNAL OF MATERIALS CHEMISTRY C. 7(15). p.4392-4402
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Template-dependent hydrophobicity in mesoporous organosilica films

Murad Redzheb (UGent) , Pascal Van Der Voort (UGent) and Silvia Armini

(2018) MICROPOROUS AND MESOPOROUS MATERIALS. 259. p.111-115
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Tuning the properties of periodic mesoporous organosilica films for low-k application by Gemini surfactants

Murad Redzheb (UGent) , Oguzhan Orkut Okudur, Sigrid Bernstorff, Krunoslav Juraic, Pascal Van Der Voort (UGent) and Silvia Armini

(2018) CHEMPHYSCHEM. 19(18). p.2295-2298
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Periodic mesoporous organosilica films with a tunable steady-state mesophase

Murad Redzheb (UGent) , Sigrid Bernstorff, Barbara Sartori, Pascal Van Der Voort (UGent) and Silvia Armini

(2017) CHEMPHYSCHEM. 18(20). p.2846-2849
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On the mechanical and electrical properties of self-assembly-based organosilicate porous films

Murad Redzheb (UGent) , Silvia Armini, Tom Berger, Matthias Jacobs, Mikhail Krishtab, Kris Vanstreels, Sigrid Bernstorff and Pascal Van Der Voort (UGent)

(2017) JOURNAL OF MATERIALS CHEMISTRY C. 5(33). p.8599-8607
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- Journal Article
- A1
- open access
Effect of the C-bridge length on the ultraviolet-resistance of oxycarbosilane low-k films

Murad Redzheb (UGent) , Lutz Prager, Sergej Naumov, Mikhail Krishtab, Silvia Armini, Pascal Van Der Voort (UGent) and Mikhail R Baklanov

(2016) APPLIED PHYSICS LETTERS. 108(1).
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UV cure of oxycarbosilane low-k films

Murad Redzheb (UGent) , Lutz Prager, Mikhail Krishtab, Silvia Armini, Kris Vanstreels, Alexis Franquet, Pascal Van Der Voort (UGent) and Mikhail R Baklanov

(2016) MICROELECTRONIC ENGINEERING. 156. p.103-107
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Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films

Yiting Sun, Elisabeth Levrau, Liping Zhang, Jef Geypen, Johan Meersschaut, Alexis Franquet, Quoc Le Le, Jean-François de Marneffe, Hugo Bender, Herbert Struyf, et al.

(2015) MICROELECTRONIC ENGINEERING. 137. p.70-74
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Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and 1/2 pitch lines : from coupon to full-wafer experiments

Silvia Armini, Steven Demuynck, Zaid El-mekki, Johan Swerts, Magi Margalit Nagar (UGent) , Aleksandar Radisic, Nancy Heylen, Gerald Beyer, Leonardus Leunissen and Philippe M Vereecken

(2011) ECS Transactions. 35(2). p.117-123

Academic Bibliography

Selective electroless deposition of cobalt using amino-terminated SAMs

Template-dependent hydrophobicity in mesoporous organosilica films

Tuning the properties of periodic mesoporous organosilica films for low-k application by Gemini surfactants

Periodic mesoporous organosilica films with a tunable steady-state mesophase

On the mechanical and electrical properties of self-assembly-based organosilicate porous films

Effect of the C-bridge length on the ultraviolet-resistance of oxycarbosilane low-k films

UV cure of oxycarbosilane low-k films

Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films

Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and 1/2 pitch lines : from coupon to full-wafer experiments

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