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Optical connections on flexible substrates
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Development of a technology for fabricating low-cost parallel optical interconnects
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Ultra-thin chip package using embedding in spin-on polyimides
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Ultra-thin chip package using embedding in spin-on polyimides
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- Conference Paper
- C1
- open access
Optical interconnections embedded in flexible substrates
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- Conference Paper
- C1
- open access
Optical interconnections embedded in flexible substrates
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UTCP: 60 µm thick bendable package
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Laser ablation of parallel optical interconnect waveguides
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45° Out-of-Plane Turning Mirrors for Optical Printed Circuit Boards
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Multilayer Optical Interconnections Integrated on a Printed Circuit Board