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- Journal Article
- A2
- open access
Challenges in introducing high-density interconnect technology in printed circuit boards for space applications
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- Journal Article
- A2
- open access
High-density interconnect technology assessment of printed circuit boards for space applications
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Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components
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How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
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- Conference Paper
- C1
- open access
Reduced 2nd level solder joint life time of low-CTE mold compound packages
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Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
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Design and implementation of flexible and stretchable systems
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Design and analysis of a novel fine pitch and highly stretchable interconnect
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- Conference Paper
- C1
- open access
Thermo-mechanical analysis of flexible and stretchable systems
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Design and performance of metal conductors for stretchable electronic circuits