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Flip-Chip technology for low cost optical interconnections.
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Accurate on wafer measurement of the large-signal behavior of a nonlinear microwave device
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High-frequency measurement based characterisation of the transmission line parameters of packages and interconnection structures
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Numerical model for quantitative verification of magnetic resonance imaging of time-dependent temperature distributions in a phantom
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An active electro-optical loop and dipole probe for electromagnetic near-field measurements
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Measuring on-wafer high-frequency modulation response characteristics of optical transmitters and detectors.
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A new algorithm for experimental circuit modeling of interconnection structures based on causality.
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Experimental circuit modeling of coupled interconnection structures based on causality
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Accurate on wafer measurement of phase and amplitude of the spectral components of incident and scattered voltage waves at the signal ports of a nonlinear microwave device
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Samenwerking industrie-universiteit helpt de EMC-materie te ontmaskeren