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  • 2021
    • A1
    • journalArticle
    On the grain size-thickness correlation for thin films Dulmaa Altangerel UGent, Florian Cougnon, Robin Dedoncker UGent and Diederik Depla UGent (2021) ACTA MATERIALIA. 212.
    • A1
    • journalArticle
    Sputter deposition with powder targets : an overview Diederik Depla UGent (2021) VACUUM. 184.
    • A1
    • journalArticle
    Influence of impurities on the front velocity of sputter deposited Al/CuO thermite multilayers Dulmaa Altangerel UGent and Diederik Depla UGent (2021) MATERIALS. 14(23).
    • A1
    • journalArticle
    Sputter deposited metal layers embedded in composites : from fundamentals to applications Florian Cougnon, Mathias Kersemans UGent, Wim Van Paepegem UGent and Diederik Depla UGent (2021) COATINGS. 11(2).
    • A1
    • journalArticle
    The growth of a multi-principal element (CoCrFeMnNi) oxynitride film by direct current magnetron sputtering using air as reactive gas G. Radnóczi, Robin Dedoncker UGent, G.Z. Radnóczi, Zs. Czigány, A. Sulyok, V. Kovács-Kis and Diederik Depla UGent (2021) SURFACE & COATINGS TECHNOLOGY. 421.
    • A1
    • journalArticle
    Nitride formation during reactive sputter deposition of multi-principal element alloys in argon/nitrogen mixtures Diederik Depla UGent, Robin Dedoncker UGent and Koen Strijckmans UGent (2021) THIN SOLID FILMS. 732.
    • A1
    • journalArticle
    Influence of the nitrogen content on the structure and properties of MoNbTaVW high entropy alloy thin films Ao Xia, Robin Dedoncker UGent, Oleksandr Glushko, Megan J. Cordill, Diederik Depla UGent and Robert Franz (2021) JOURNAL OF ALLOYS AND COMPOUNDS. 850.
    • A1
    • journalArticle
    Understanding residual stress in thin films : analyzing wafer curvature measurements for Ag, Cu, Ni, Fe, Ti, and Cr with a kinetic model Zhaoxia Rao, Sarah Berman, Peilin Yang, Diederik Depla UGent and Eric Chason (2021) JOURNAL OF APPLIED PHYSICS. 130(13).
    • A1
    • journalArticle
    Plasma-enhanced atomic layer deposition : correlating O2 plasma parameters and species to blister formation and conformal film growth Andreas Werbrouck UGent, Kevin Van de Kerckhove, Diederik Depla UGent, Dirk Poelman UGent, Philippe Smet UGent, Jolien Dendooven UGent and Christophe Detavernier UGent (2021) JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A. 39(6).
  • 2020
    • A1
    • journalArticle
    Sputter yield measurements to evaluate the target state during reactive magnetron sputtering Roeland Schelfhout UGent, Koen Strijckmans UGent and Diederik Depla UGent (2020) SURFACE & COATINGS TECHNOLOGY. 399.
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