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Packaging of opto-electronic devices for flexible applications

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Jeroen Missinne (UGent) , Bram Van Hoe (UGent) and Peter Van Daele (UGent)
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Abstract
This paper presents the latest results on the development of a thin flexible package of commercially available optoelectronics with polymer multimode waveguides. The GaAs VCSELs and Photodiodes are thinned down to 20 μ m thickness, resulting in packages which can be bended to a bending radius of 2 mm with high reliability. With these actives, also waveguides and out-of-plane coupling structures are embedded inside the foil. Flexible Polyimide micromirrors were fabricated, characterized and embedded inside the foil. An embedded VCSEL to Photodiode optical waveguide link was demonstrated at a speed of 1.2 Gbs with open eye diagram. Temperature (-40 to 125 degrees Celsius) and humidity (85 rh/85 degrees C for 1000 hours) reliability was tested with good results. The total thickness of the completed foil containing actives, waveguides and coupling elements is only 145 μm.
Keywords
embedding, INTERCONNECTION, optical interconnect, VCSEL, thin chip, flexible, Opto-electronic packaging

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Please use this url to cite or link to this publication:

Chicago
Bosman, Erwin, Geert Van Steenberge, Jeroen Missinne, Bram Van Hoe, and Peter Van Daele. 2010. “Packaging of Opto-electronic Devices for Flexible Applications.” In Proceedings of SPIE, the International Society for Optical Engineering, ed. Alexei L Glebov and Ray T Chen. Vol. 7607. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
APA
Bosman, E., Van Steenberge, G., Missinne, J., Van Hoe, B., & Van Daele, P. (2010). Packaging of opto-electronic devices for flexible applications. In A. L. Glebov & R. T. Chen (Eds.), Proceedings of SPIE, the International Society for Optical Engineering (Vol. 7607). Presented at the Optoelectronic Interconnects and Component Integration IX, Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Vancouver
1.
Bosman E, Van Steenberge G, Missinne J, Van Hoe B, Van Daele P. Packaging of opto-electronic devices for flexible applications. In: Glebov AL, Chen RT, editors. Proceedings of SPIE, the International Society for Optical Engineering. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering; 2010.
MLA
Bosman, Erwin, Geert Van Steenberge, Jeroen Missinne, et al. “Packaging of Opto-electronic Devices for Flexible Applications.” Proceedings of SPIE, the International Society for Optical Engineering. Ed. Alexei L Glebov & Ray T Chen. Vol. 7607. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering, 2010. Print.
@inproceedings{974908,
  abstract     = {This paper presents the latest results on the development of a thin flexible package of commercially available optoelectronics with polymer multimode waveguides. The GaAs VCSELs and Photodiodes are thinned down to 20 \ensuremath{\mu} m thickness, resulting in packages which can be bended to a bending radius of 2 mm with high reliability. With these actives, also waveguides and out-of-plane coupling structures are embedded inside the foil. Flexible Polyimide micromirrors were fabricated, characterized and embedded inside the foil. An embedded VCSEL to Photodiode optical waveguide link was demonstrated at a speed of 1.2 Gbs with open eye diagram. Temperature (-40 to 125 degrees Celsius) and humidity (85 rh/85 degrees C for 1000 hours) reliability was tested with good results. The total thickness of the completed foil containing actives, waveguides and coupling elements is only 145 \ensuremath{\mu}m.},
  articleno    = {76070G},
  author       = {Bosman, Erwin and Van Steenberge, Geert and Missinne, Jeroen and Van Hoe, Bram and Van Daele, Peter},
  booktitle    = {Proceedings of SPIE, the International Society for Optical Engineering},
  editor       = {Glebov, Alexei L and Chen, Ray T},
  isbn         = {9780819480033},
  issn         = {0277-786X},
  language     = {eng},
  location     = {San Francisco, CA, USA},
  pages        = {10},
  publisher    = {SPIE, the International Society for Optical Engineering},
  title        = {Packaging of opto-electronic devices for flexible applications},
  url          = {http://dx.doi.org/10.1117/12.841553},
  volume       = {7607},
  year         = {2010},
}

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