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Abstract
One of the grand challenges in solving the interconnection bottlenecks at the Printed Circuit Board (PCB) and Multi-Chip-Module (MCM) level, is to adequately replace the PCB and intra-MCM galvanic interconnects with high-performance, low-cost, compact and reliable micro-photonic alternatives. Therefore we address the following components in this paper: 1) out-of-plane couplers for optical waveguides embedded in PCB, 2) peripheral fiber ribbons and mo-dimensional single- and multimode fiber connectors for high-speed parallel optical connections, 3) intra-MCM level optical interconnections via free-space optical modules. For the fabrication of these micro-optical interconnect modules, we are focusing at the Vrije Universiteit Brussel on the continuous development of a rapid prototyping technology, which we call Deep Proton Writing (DPW). The special feature of this prototyping technology is that it is compatible with commercial low-cost mass replication techniques such as micro injection moulding and hot embossing. Laser ablation is used at Ghent University for the fabrication of PCB-embedded waveguides and integrated micro-mirrors. The main advantage of this technology is that it is compatible with present-day PCB manufacturing. For the free-space MCM-level optical interconnect module, we furthermore give special attention to the optical tolerancing and the opto-mechanical integration of the components. We use both a sensitivity analysis to misali-ninent errors and Monte Carlo simulations. It is our aim to investigate the whole component integration chain from the optoelectronic device to the micro-opto-mechanical components constituting the interconnect module.
Keywords
out-of-plane coupling, replication techniques, polymer multimode waveguides, optical interconnections, fiber connectors, deep proton writing (DPW), micro-optics, laser ablation, DESIGN, SYSTEM, MIRRORS, OPTICAL WAVE-GUIDE

Citation

Please use this url to cite or link to this publication:

MLA
Van Erps, Jurgen, Christof Debaes, Michael Vervaeke, et al. “Low-cost Micro-optics for PCB-level Photonic Interconnects.” Proceedings of the Society of Photo-optical Instrumentation Engineers (spie). Ed. AM Earman & RT Chen. Vol. 6478. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering, 2007. XI–XXIV. Print.
APA
Van Erps, Jurgen, Debaes, C., Vervaeke, M., Desmet, L., Hendrickx, N., Van Steenberge, G., Ottevaere, H., et al. (2007). Low-cost micro-optics for PCB-level photonic interconnects. In A. Earman & R. Chen (Eds.), PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE) (Vol. 6478, p. XI–XXIV). Presented at the Conference on Photonics Packaging, Integration, and Interconnects VII, Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Chicago author-date
Van Erps, Jurgen, Christof Debaes, Michael Vervaeke, Lieven Desmet, Nina Hendrickx, Geert Van Steenberge, Heidi Ottevaere, et al. 2007. “Low-cost Micro-optics for PCB-level Photonic Interconnects.” In Proceedings of the Society of Photo-optical Instrumentation Engineers (spie), ed. AM Earman and RT Chen, 6478:XI–XXIV. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Chicago author-date (all authors)
Van Erps, Jurgen, Christof Debaes, Michael Vervaeke, Lieven Desmet, Nina Hendrickx, Geert Van Steenberge, Heidi Ottevaere, Pedro Vynck, Virginia Gomez, Sara Van Overneire, Yuzo Ishii, Peter Van Daele, Alex Hermanne, and Hugo Thienpont. 2007. “Low-cost Micro-optics for PCB-level Photonic Interconnects.” In Proceedings of the Society of Photo-optical Instrumentation Engineers (spie), ed. AM Earman and RT Chen, 6478:XI–XXIV. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Vancouver
1.
Van Erps J, Debaes C, Vervaeke M, Desmet L, Hendrickx N, Van Steenberge G, et al. Low-cost micro-optics for PCB-level photonic interconnects. In: Earman A, Chen R, editors. PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). Bellingham, WA, USA: SPIE, the International Society for Optical Engineering; 2007. p. XI–XXIV.
IEEE
[1]
J. Van Erps et al., “Low-cost micro-optics for PCB-level photonic interconnects,” in PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), San José, CA, USA, 2007, vol. 6478, pp. XI–XXIV.
@inproceedings{974715,
  abstract     = {One of the grand challenges in solving the interconnection bottlenecks at the Printed Circuit Board (PCB) and Multi-Chip-Module (MCM) level, is to adequately replace the PCB and intra-MCM galvanic interconnects with high-performance, low-cost, compact and reliable micro-photonic alternatives. Therefore we address the following components in this paper: 1) out-of-plane couplers for optical waveguides embedded in PCB, 2) peripheral fiber ribbons and mo-dimensional single- and multimode fiber connectors for high-speed parallel optical connections, 3) intra-MCM level optical interconnections via free-space optical modules.
For the fabrication of these micro-optical interconnect modules, we are focusing at the Vrije Universiteit Brussel on the continuous development of a rapid prototyping technology, which we call Deep Proton Writing (DPW). The special feature of this prototyping technology is that it is compatible with commercial low-cost mass replication techniques such as micro injection moulding and hot embossing. Laser ablation is used at Ghent University for the fabrication of PCB-embedded waveguides and integrated micro-mirrors. The main advantage of this technology is that it is compatible with present-day PCB manufacturing.
For the free-space MCM-level optical interconnect module, we furthermore give special attention to the optical tolerancing and the opto-mechanical integration of the components. We use both a sensitivity analysis to misali-ninent errors and Monte Carlo simulations. It is our aim to investigate the whole component integration chain from the optoelectronic device to the micro-opto-mechanical components constituting the interconnect module.},
  articleno    = {64760L},
  author       = {Van Erps, Jurgen and Debaes, Christof and Vervaeke, Michael and Desmet, Lieven and Hendrickx, Nina and Van Steenberge, Geert and Ottevaere, Heidi and Vynck, Pedro and Gomez, Virginia and Van Overneire, Sara and Ishii, Yuzo and Van Daele, Peter and Hermanne, Alex and Thienpont, Hugo},
  booktitle    = {PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE)},
  editor       = {Earman, AM and Chen, RT},
  isbn         = {9780819465917},
  issn         = {0277-786X},
  keywords     = {out-of-plane coupling,replication techniques,polymer multimode waveguides,optical interconnections,fiber connectors,deep proton writing (DPW),micro-optics,laser ablation,DESIGN,SYSTEM,MIRRORS,OPTICAL WAVE-GUIDE},
  language     = {eng},
  location     = {San José, CA, USA},
  pages        = {64760L:XI--64760L:XXIV},
  publisher    = {SPIE, the International Society for Optical Engineering},
  title        = {Low-cost micro-optics for PCB-level photonic interconnects},
  url          = {http://dx.doi.org/10.1117/12.705844},
  volume       = {6478},
  year         = {2007},
}

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