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Low-cost micro-optics for PCB-level photonic interconnects

Jurgen Van Erps, Christof Debaes, Michael Vervaeke, Lieven Desmet, Nina Hendrickx UGent, Geert Van Steenberge UGent, Heidi Ottevaere, Pedro Vynck, Virginia Gomez, Sara Van Overmeire, et al. (2007) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). In PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE) 6476.
abstract
One of the grand challenges in solving the interconnection bottlenecks at the Printed Circuit Board (PCB) and Multi-Chip-Module (MCM) level, is to adequately replace the PCB and intra-MCM galvanic interconnects with high-performance, low-cost, compact and reliable micro-photonic-alternatives. Therefore we address the following components in this paper: 1) out-of-plane couplers for optical waveguides embedded in PCB, 2) peripheral fiber ribbons and two-dimensional single- and multimode fiber connectors for high-speed parallel optical connections, and 3) intra-MCM level optical interconnections via free-space optical modules. For the fabrication of these micro-optical interconnect modules, we are focusing at the Vrije Universiteit Brussel on the continuous development of a rapid prototyping technology, which we call Deep Proton Writing (DPW). The special feature of this prototyping technology is that it is compatible with commercial low-cost mass replication techniques such as micro injection moulding and hot embossing. Laser ablation is used at Ghent University for the fabrication of PCB-embedded waveguides; and integrated micro-mirrors. The main advantage of this technology is that it is compatible with present-day PCB manufacturing. For the free-space MCM-level optical interconnect module, we furthermore give special attention to the optical tolerancing and the opto-mechanical integration of the components. We use both a sensitivity analysis to misalignment errors and Monte Carlo simulations. It is our aim to investigate the whole component integration chain from the optoelectronic device to the micro-opto-mechanical components constituting the interconnect module.
Please use this url to cite or link to this publication:
author
organization
year
type
conference (proceedingsPaper)
publication status
published
subject
keyword
polymer multimode waveguides, replication techniques, out-of-plane coupling, optical interconnections, micro-optics, laser ablation, fiber connectors, deep proton writing (DPW), MIRRORS, OPTICAL WAVE-GUIDE, TOOL
in
PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE)
Proc. Soc. Photo-Opt. Instrum. Eng. (SPIE)
editor
LA Eldada and EH Lee
series title
PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE)
volume
6476
issue title
Optoelectronic Integrated Circuits IX
article number
64760L
pages
14 pages
publisher
SPIE, the International Society for Optical Engineering
place of publication
Bellingham, WA, USA
conference name
Conference on Optoelectronic Integrated Circuits IX
conference location
San José, CA, USA
conference start
2007-01-22
conference end
2007-01-24
Web of Science type
Proceedings Paper
Web of Science id
000246080100017
ISSN
0277-786X
ISBN
9780819465894
DOI
10.1117/12.705844
language
English
UGent publication?
yes
classification
P1
id
974698
handle
http://hdl.handle.net/1854/LU-974698
date created
2010-06-09 09:24:03
date last changed
2017-01-02 09:52:55
@inproceedings{974698,
  abstract     = {One of the grand challenges in solving the interconnection bottlenecks at the Printed Circuit Board (PCB) and Multi-Chip-Module (MCM) level, is to adequately replace the PCB and intra-MCM galvanic interconnects with high-performance, low-cost, compact and reliable micro-photonic-alternatives. Therefore we address the following components in this paper: 1) out-of-plane couplers for optical waveguides embedded in PCB, 2) peripheral fiber ribbons and two-dimensional single- and multimode fiber connectors for high-speed parallel optical connections, and 3) intra-MCM level optical interconnections via free-space optical modules.
For the fabrication of these micro-optical interconnect modules, we are focusing at the Vrije Universiteit Brussel on the continuous development of a rapid prototyping technology, which we call Deep Proton Writing (DPW). The special feature of this prototyping technology is that it is compatible with commercial low-cost mass replication techniques such as micro injection moulding and hot embossing. Laser ablation is used at Ghent University for the fabrication of PCB-embedded waveguides; and integrated micro-mirrors. The main advantage of this technology is that it is compatible with present-day PCB manufacturing.
For the free-space MCM-level optical interconnect module, we furthermore give special attention to the optical tolerancing and the opto-mechanical integration of the components. We use both a sensitivity analysis to misalignment errors and Monte Carlo simulations. It is our aim to investigate the whole component integration chain from the optoelectronic device to the micro-opto-mechanical components constituting the interconnect module.},
  articleno    = {64760L},
  author       = {Van Erps, Jurgen and Debaes, Christof and Vervaeke, Michael and Desmet, Lieven and Hendrickx, Nina and Van Steenberge, Geert and Ottevaere, Heidi and Vynck, Pedro and Gomez, Virginia and Van Overmeire, Sara and Ishii, Yuzo and Van Daele, Peter and Hermanne, Alex and Thienpont, Hugo},
  booktitle    = {PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE)},
  editor       = {Eldada, LA and Lee, EH},
  isbn         = {9780819465894},
  issn         = {0277-786X},
  keyword      = {polymer multimode waveguides,replication techniques,out-of-plane coupling,optical interconnections,micro-optics,laser ablation,fiber connectors,deep proton writing (DPW),MIRRORS,OPTICAL WAVE-GUIDE,TOOL},
  language     = {eng},
  location     = {San Jos{\'e}, CA, USA},
  pages        = {14},
  publisher    = {SPIE, the International Society for Optical Engineering},
  title        = {Low-cost micro-optics for PCB-level photonic interconnects},
  url          = {http://dx.doi.org/10.1117/12.705844},
  volume       = {6476},
  year         = {2007},
}

Chicago
Van Erps, Jurgen, Christof Debaes, Michael Vervaeke, Lieven Desmet, Nina Hendrickx, Geert Van Steenberge, Heidi Ottevaere, et al. 2007. “Low-cost Micro-optics for PCB-level Photonic Interconnects.” In Proceedings of the Society of Photo-optical Instrumentation Engineers (spie), ed. LA Eldada and EH Lee. Vol. 6476. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
APA
Van Erps, Jurgen, Debaes, C., Vervaeke, M., Desmet, L., Hendrickx, N., Van Steenberge, G., Ottevaere, H., et al. (2007). Low-cost micro-optics for PCB-level photonic interconnects. In L. Eldada & E. Lee (Eds.), PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE) (Vol. 6476). Presented at the Conference on Optoelectronic Integrated Circuits IX, Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Vancouver
1.
Van Erps J, Debaes C, Vervaeke M, Desmet L, Hendrickx N, Van Steenberge G, et al. Low-cost micro-optics for PCB-level photonic interconnects. In: Eldada L, Lee E, editors. PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). Bellingham, WA, USA: SPIE, the International Society for Optical Engineering; 2007.
MLA
Van Erps, Jurgen, Christof Debaes, Michael Vervaeke, et al. “Low-cost Micro-optics for PCB-level Photonic Interconnects.” Proceedings of the Society of Photo-optical Instrumentation Engineers (spie). Ed. LA Eldada & EH Lee. Vol. 6476. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering, 2007. Print.