Influence of interface materials on the thermal impedance of electronic packages
- Author
- Gilbert De Mey (UGent) , J Pilarski, M Wojcik, M Lasota, Jedrzej Banaszczyk (UGent) , Bjorn Vermeersch (UGent) and A Napieralski
- Organization
- Keywords
- Thermal resistance, Forced convection, Interface materials
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-905973
- MLA
- De Mey, Gilbert, et al. “Influence of Interface Materials on the Thermal Impedance of Electronic Packages.” INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, vol. 36, no. 3, 2009, pp. 210–12, doi:10.1016/j.icheatmasstransfer.2008.10.016.
- APA
- De Mey, G., Pilarski, J., Wojcik, M., Lasota, M., Banaszczyk, J., Vermeersch, B., & Napieralski, A. (2009). Influence of interface materials on the thermal impedance of electronic packages. INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 36(3), 210–212. https://doi.org/10.1016/j.icheatmasstransfer.2008.10.016
- Chicago author-date
- De Mey, Gilbert, J Pilarski, M Wojcik, M Lasota, Jedrzej Banaszczyk, Bjorn Vermeersch, and A Napieralski. 2009. “Influence of Interface Materials on the Thermal Impedance of Electronic Packages.” INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER 36 (3): 210–12. https://doi.org/10.1016/j.icheatmasstransfer.2008.10.016.
- Chicago author-date (all authors)
- De Mey, Gilbert, J Pilarski, M Wojcik, M Lasota, Jedrzej Banaszczyk, Bjorn Vermeersch, and A Napieralski. 2009. “Influence of Interface Materials on the Thermal Impedance of Electronic Packages.” INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER 36 (3): 210–212. doi:10.1016/j.icheatmasstransfer.2008.10.016.
- Vancouver
- 1.De Mey G, Pilarski J, Wojcik M, Lasota M, Banaszczyk J, Vermeersch B, et al. Influence of interface materials on the thermal impedance of electronic packages. INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER. 2009;36(3):210–2.
- IEEE
- [1]G. De Mey et al., “Influence of interface materials on the thermal impedance of electronic packages,” INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, vol. 36, no. 3, pp. 210–212, 2009.
@article{905973,
author = {{De Mey, Gilbert and Pilarski, J and Wojcik, M and Lasota, M and Banaszczyk, Jedrzej and Vermeersch, Bjorn and Napieralski, A}},
issn = {{0735-1933}},
journal = {{INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER}},
keywords = {{Thermal resistance,Forced convection,Interface materials}},
language = {{eng}},
number = {{3}},
pages = {{210--212}},
title = {{Influence of interface materials on the thermal impedance of electronic packages}},
url = {{http://doi.org/10.1016/j.icheatmasstransfer.2008.10.016}},
volume = {{36}},
year = {{2009}},
}
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