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Fabrication processes for embedding thin chips in flat flexible substrates

Jonathan Govaerts (UGent) , Wim Christiaens (UGent) , Erwin Bosman (UGent) and Jan Vanfleteren (UGent)
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Abstract
These days, a lot of effort is being put in making electronic devices lighter and compacter, as the electronics market is rapidly expanding with all sorts of portable devices for home and everyday use. In this paper, a technology for embedding thin chips in flexible substrates is proposed that could be the next step for further reducing weight, while at the same time enhancing mechanical flexibility of the electronic circuitry. All stages in the technology's development cycle are discussed: from technology flow, test design and actual fabrication, to process optimization and characterization of the results. An outlook on the following steps of this technology is discussed in the conclusion.
Keywords
Embedding, thin chip, flexible package

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Citation

Please use this url to cite or link to this publication:

Chicago
Govaerts, Jonathan, Wim Christiaens, Erwin Bosman, and Jan Vanfleteren. 2009. “Fabrication Processes for Embedding Thin Chips in Flat Flexible Substrates.” Ieee Transactions on Advanced Packaging 32 (1): 77–83.
APA
Govaerts, J., Christiaens, W., Bosman, E., & Vanfleteren, J. (2009). Fabrication processes for embedding thin chips in flat flexible substrates. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 32(1), 77–83.
Vancouver
1.
Govaerts J, Christiaens W, Bosman E, Vanfleteren J. Fabrication processes for embedding thin chips in flat flexible substrates. IEEE TRANSACTIONS ON ADVANCED PACKAGING. 2009;32(1):77–83.
MLA
Govaerts, Jonathan, Wim Christiaens, Erwin Bosman, et al. “Fabrication Processes for Embedding Thin Chips in Flat Flexible Substrates.” IEEE TRANSACTIONS ON ADVANCED PACKAGING 32.1 (2009): 77–83. Print.
@article{905922,
  abstract     = {These days, a lot of effort is being put in making electronic devices lighter and compacter, as the electronics market is rapidly expanding with all sorts of portable devices for home and everyday use. In this paper, a technology for embedding thin chips in flexible substrates is proposed that could be the next step for further reducing weight, while at the same time enhancing mechanical flexibility of the electronic circuitry. All stages in the technology's development cycle are discussed: from technology flow, test design and actual fabrication, to process optimization and characterization of the results. An outlook on the following steps of this technology is discussed in the conclusion.},
  author       = {Govaerts, Jonathan and Christiaens, Wim and Bosman, Erwin and Vanfleteren, Jan},
  issn         = {1521-3323},
  journal      = {IEEE TRANSACTIONS ON ADVANCED PACKAGING},
  language     = {eng},
  number       = {1},
  pages        = {77--83},
  title        = {Fabrication processes for embedding thin chips in flat flexible substrates},
  url          = {http://dx.doi.org/10.1109/TADVP.2008.2005838},
  volume       = {32},
  year         = {2009},
}

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