
A defect characterization technique for the sidewall surface of Nano-ridge and Nanowire based Logic and RF technologies
- Author
- A. Vais, B. Hsu, O. Syshchyk, H. Yu, A. Alian, Y. Mols, V Kodandarama, K., B. Kunert, N. Waldron, Eddy Simoen (UGent) and N. Collaert
- Organization
- Abstract
- We introduce a set of new characterization techniques for the direct defect analysis of the sidewall surfaces of Nano-ridge, Nanowire, and FinFET based devices, being used in current (and future) logic and RF technologies. We demonstrate the application of these techniques on GaAs mesa, Nano-ridge, and InGaAs nano-wire based PIN diodes where surface defect densities are difficult to extract currently. We show that a close match in extracted density, with both measured data and calibrated TCAD simulations of above device types, is achieved validating the applicability of the techniques.
- Keywords
- LEVEL TRANSIENT SPECTROSCOPY, RECOMBINATION, TRAPS, III-V, III-V defects, Nano-wire sidewall defects, Nano-ridge devices, Hetero-junction Bipolar transistor
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-8752502
- MLA
- Vais, A., et al. “A Defect Characterization Technique for the Sidewall Surface of Nano-Ridge and Nanowire Based Logic and RF Technologies.” 2021 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), Ieee, 2021, doi:10.1109/IRPS46558.2021.9405095.
- APA
- Vais, A., Hsu, B., Syshchyk, O., Yu, H., Alian, A., Mols, Y., … Collaert, N. (2021). A defect characterization technique for the sidewall surface of Nano-ridge and Nanowire based Logic and RF technologies. 2021 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS). Presented at the IEEE International Reliability Physics Symposium (IRPS), ELECTR NETWORK. https://doi.org/10.1109/IRPS46558.2021.9405095
- Chicago author-date
- Vais, A., B. Hsu, O. Syshchyk, H. Yu, A. Alian, Y. Mols, V Kodandarama, K., et al. 2021. “A Defect Characterization Technique for the Sidewall Surface of Nano-Ridge and Nanowire Based Logic and RF Technologies.” In 2021 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS). New york: Ieee. https://doi.org/10.1109/IRPS46558.2021.9405095.
- Chicago author-date (all authors)
- Vais, A., B. Hsu, O. Syshchyk, H. Yu, A. Alian, Y. Mols, V Kodandarama, K., B. Kunert, N. Waldron, Eddy Simoen, and N. Collaert. 2021. “A Defect Characterization Technique for the Sidewall Surface of Nano-Ridge and Nanowire Based Logic and RF Technologies.” In 2021 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS). New york: Ieee. doi:10.1109/IRPS46558.2021.9405095.
- Vancouver
- 1.Vais A, Hsu B, Syshchyk O, Yu H, Alian A, Mols Y, et al. A defect characterization technique for the sidewall surface of Nano-ridge and Nanowire based Logic and RF technologies. In: 2021 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS). New york: Ieee; 2021.
- IEEE
- [1]A. Vais et al., “A defect characterization technique for the sidewall surface of Nano-ridge and Nanowire based Logic and RF technologies,” in 2021 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), ELECTR NETWORK, 2021.
@inproceedings{8752502, abstract = {{We introduce a set of new characterization techniques for the direct defect analysis of the sidewall surfaces of Nano-ridge, Nanowire, and FinFET based devices, being used in current (and future) logic and RF technologies. We demonstrate the application of these techniques on GaAs mesa, Nano-ridge, and InGaAs nano-wire based PIN diodes where surface defect densities are difficult to extract currently. We show that a close match in extracted density, with both measured data and calibrated TCAD simulations of above device types, is achieved validating the applicability of the techniques.}}, author = {{Vais, A. and Hsu, B. and Syshchyk, O. and Yu, H. and Alian, A. and Mols, Y. and Kodandarama, K., V and Kunert, B. and Waldron, N. and Simoen, Eddy and Collaert, N.}}, booktitle = {{2021 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)}}, isbn = {{9781728168937}}, issn = {{1541-7026}}, keywords = {{LEVEL TRANSIENT SPECTROSCOPY,RECOMBINATION,TRAPS,III-V,III-V defects,Nano-wire sidewall defects,Nano-ridge devices,Hetero-junction Bipolar transistor}}, language = {{eng}}, location = {{ELECTR NETWORK}}, pages = {{5}}, publisher = {{Ieee}}, title = {{A defect characterization technique for the sidewall surface of Nano-ridge and Nanowire based Logic and RF technologies}}, url = {{http://doi.org/10.1109/IRPS46558.2021.9405095}}, year = {{2021}}, }
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