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PIXAPP photonics packaging pilot line development of a silicon photonic optical transceiver with pluggable fiber connectivity

Ivan-Lazar Bundalo, Padraic Edward Morrissey, Andrea Annoni, Roel Baets (UGent) , Fabrice Blache, Laurens Breyne, Lee Carroll, Sean Collins, Philipp-Immanuel Dietrich, Leos Halmo, et al.
(2022) IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS. 28(3).
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Abstract
This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPP's open access packaging design rules or Assembly Design Kit (ADK). The transceiver was designed to have the Tx and Rx elements integrated on to a single silicon photonic chip, together with flipchip control electronics, hybrid laser and micro-optics. The transceiver used the on-chip micro-optics to enable a pluggable fiber connection, avoiding the need to bond optical fibers directly to the photonic chip. Finally, the packaged transceiver module was tested, showing 56 Gb/s loop-back modulation and de-modulation, validating both the transmitter and receiver performance.
Keywords
Electrical and Electronic Engineering, Atomic and Molecular Physics, Optics, Packaging, Photonics, Integrated optics, Optical device fabrication, High-speed optical techniques, Optical fibers, Optical transmitters, Electrooptic modulators, chip scale packaging, demodulation, electronic packaging thermal management, electronics packaging, high-speed electronics, high-speed integrated circuits, intensity modulation, modulation, PIC, PIC packaging, photonics, semiconductor device packaging, silicon photonics, telecommunications, communication systems, TECHNOLOGY

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Citation

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MLA
Bundalo, Ivan-Lazar, et al. “PIXAPP Photonics Packaging Pilot Line Development of a Silicon Photonic Optical Transceiver with Pluggable Fiber Connectivity.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, vol. 28, no. 3, 2022, doi:10.1109/jstqe.2022.3158891.
APA
Bundalo, I.-L., Morrissey, P. E., Annoni, A., Baets, R., Blache, F., Breyne, L., … O’brien, P. (2022). PIXAPP photonics packaging pilot line development of a silicon photonic optical transceiver with pluggable fiber connectivity. IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 28(3). https://doi.org/10.1109/jstqe.2022.3158891
Chicago author-date
Bundalo, Ivan-Lazar, Padraic Edward Morrissey, Andrea Annoni, Roel Baets, Fabrice Blache, Laurens Breyne, Lee Carroll, et al. 2022. “PIXAPP Photonics Packaging Pilot Line Development of a Silicon Photonic Optical Transceiver with Pluggable Fiber Connectivity.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 28 (3). https://doi.org/10.1109/jstqe.2022.3158891.
Chicago author-date (all authors)
Bundalo, Ivan-Lazar, Padraic Edward Morrissey, Andrea Annoni, Roel Baets, Fabrice Blache, Laurens Breyne, Lee Carroll, Sean Collins, Philipp-Immanuel Dietrich, Leos Halmo, Filipe Jorge, Mikko Karppinen, Mikko Kaunisto, Brian Kelly, Joris Van Kerrebrouck, Christian Koos, Markku Lahti, Joris Lambrecht, Marcello Tienforti, Jun Su Lee, Jeroen Missinne, Peter Ossieur, Roberto Pessina, Tom Sterken, Geert Van Steenberge, Antonello Vannucci, Alessandro Vannucchi, Rik Verplancke, Pieter Wuytens, Yilin Xu, Martin Zoldak, and Peter O’brien. 2022. “PIXAPP Photonics Packaging Pilot Line Development of a Silicon Photonic Optical Transceiver with Pluggable Fiber Connectivity.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 28 (3). doi:10.1109/jstqe.2022.3158891.
Vancouver
1.
Bundalo I-L, Morrissey PE, Annoni A, Baets R, Blache F, Breyne L, et al. PIXAPP photonics packaging pilot line development of a silicon photonic optical transceiver with pluggable fiber connectivity. IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS. 2022;28(3).
IEEE
[1]
I.-L. Bundalo et al., “PIXAPP photonics packaging pilot line development of a silicon photonic optical transceiver with pluggable fiber connectivity,” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, vol. 28, no. 3, 2022.
@article{8747260,
  abstract     = {{This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPP's open access packaging design rules or Assembly Design Kit (ADK). The transceiver was designed to have the Tx and Rx elements integrated on to a single silicon photonic chip, together with flipchip control electronics, hybrid laser and micro-optics. The transceiver used the on-chip micro-optics to enable a pluggable fiber connection, avoiding the need to bond optical fibers directly to the photonic chip. Finally, the packaged transceiver module was tested, showing 56 Gb/s loop-back modulation and de-modulation, validating both the transmitter and receiver performance.}},
  articleno    = {{8300311}},
  author       = {{Bundalo, Ivan-Lazar and Morrissey, Padraic Edward and Annoni, Andrea and Baets, Roel and Blache, Fabrice and Breyne, Laurens and Carroll, Lee and Collins, Sean and Dietrich, Philipp-Immanuel and Halmo, Leos and Jorge, Filipe and Karppinen, Mikko and Kaunisto, Mikko and Kelly, Brian and Van Kerrebrouck, Joris and Koos, Christian and Lahti, Markku and Lambrecht, Joris and Tienforti, Marcello and Lee, Jun Su and Missinne, Jeroen and Ossieur, Peter and Pessina, Roberto and Sterken, Tom and Van Steenberge, Geert and Vannucci, Antonello and Vannucchi, Alessandro and Verplancke, Rik and Wuytens, Pieter and Xu, Yilin and Zoldak, Martin and O'brien, Peter}},
  issn         = {{1077-260X}},
  journal      = {{IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS}},
  keywords     = {{Electrical and Electronic Engineering,Atomic and Molecular Physics,Optics,Packaging,Photonics,Integrated optics,Optical device fabrication,High-speed optical techniques,Optical fibers,Optical transmitters,Electrooptic modulators,chip scale packaging,demodulation,electronic packaging thermal management,electronics packaging,high-speed electronics,high-speed integrated circuits,intensity modulation,modulation,PIC,PIC packaging,photonics,semiconductor device packaging,silicon photonics,telecommunications,communication systems,TECHNOLOGY}},
  language     = {{eng}},
  number       = {{3}},
  pages        = {{11}},
  title        = {{PIXAPP photonics packaging pilot line development of a silicon photonic optical transceiver with pluggable fiber connectivity}},
  url          = {{http://doi.org/10.1109/jstqe.2022.3158891}},
  volume       = {{28}},
  year         = {{2022}},
}
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