@article{8734073,
  abstract     = {{Electronic textiles (e-textiles) and wearable computing have been emerging increasingly during the last decade. Since the market interest and predictions have grown, the research into increasing reliability and durability of wearables and e-textiles is developing rapidly. The washability of different integration methods and resistance to mechanical stress are the main obstacles being tackled. However, the freedom of movement and overall comfort is still often overlooked during the development phase. It is essential to see the e-textile product as a whole and consider several aspects of user experience. This work will focus on developing and improving the thermoplastic polyurethane (TPU) lamination integration method for e-textiles. In the work, a stretchable copper-polyimide based circuit was laminated onto knit fabric using various TPU films and stacks. The study shares measurable characteristics to determine which material assembly and design would ensure the highest durability for the electronics part without losing its original textile softness, flexibility and stretchability.}},
  articleno    = {{156}},
  author       = {{Veske-Lepp, Paula and Bossuyt, Frederick and Vanfleteren, Jan}},
  issn         = {{1424-8220}},
  journal      = {{SENSORS}},
  keywords     = {{Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics,and Optics,Analytical Chemistry,e-textiles,stretchable electronics,wearables,packaging,washing reliability,LAUNDERABILITY,YARNS}},
  language     = {{eng}},
  number       = {{1}},
  pages        = {{15}},
  title        = {{Testing for wearability and reliability of TPU lamination method in e-textiles}},
  url          = {{http://doi.org/10.3390/s22010156}},
  volume       = {{22}},
  year         = {{2022}},
}

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