Substrate integrated components for passive millimeterwave-frequency beamforming networks
- Author
- Laura Van Messem (UGent) , Arno Moerman (UGent) , Olivier Caytan (UGent) , Igor Lima de Paula (UGent) , Bram Hoflack (UGent) , Bram Stroobandt (UGent) , Sam Lemey (UGent) and Hendrik Rogier (UGent)
- Organization
- Abstract
- In this paper, we propose passive millimeterwave (mmWave) components for Butler matrix beamforming networks implemented in grounded-coplanar waveguide (GCPW) technology designed for integration and co-optimization with an antenna array operating in the 28GHz 5G band. Within the frequency band of interest, covering the [26.5GHz-29.5GHz] spectrum, the insertion loss of the designed hybrid coupler and crossover stays well below 0.75 dB, while the amplitude imbalance remains below 0.5 dB and the phase imbalance does not exceed 5 degrees.
- Keywords
- Hybrid coupler, Crossover, GCPW, Multi-layer PCB, mmWave, 5G, Beamforming, BUTLER MATRIX, ARRAY
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-8733222
- MLA
- Van Messem, Laura, et al. “Substrate Integrated Components for Passive Millimeterwave-Frequency Beamforming Networks.” 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), IEEE, 2021, pp. 272–74, doi:10.1109/IMWS-AMP53428.2021.9644020.
- APA
- Van Messem, L., Moerman, A., Caytan, O., Lima de Paula, I., Hoflack, B., Stroobandt, B., … Rogier, H. (2021). Substrate integrated components for passive millimeterwave-frequency beamforming networks. 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 272–274. https://doi.org/10.1109/IMWS-AMP53428.2021.9644020
- Chicago author-date
- Van Messem, Laura, Arno Moerman, Olivier Caytan, Igor Lima de Paula, Bram Hoflack, Bram Stroobandt, Sam Lemey, and Hendrik Rogier. 2021. “Substrate Integrated Components for Passive Millimeterwave-Frequency Beamforming Networks.” In 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 272–74. IEEE. https://doi.org/10.1109/IMWS-AMP53428.2021.9644020.
- Chicago author-date (all authors)
- Van Messem, Laura, Arno Moerman, Olivier Caytan, Igor Lima de Paula, Bram Hoflack, Bram Stroobandt, Sam Lemey, and Hendrik Rogier. 2021. “Substrate Integrated Components for Passive Millimeterwave-Frequency Beamforming Networks.” In 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 272–274. IEEE. doi:10.1109/IMWS-AMP53428.2021.9644020.
- Vancouver
- 1.Van Messem L, Moerman A, Caytan O, Lima de Paula I, Hoflack B, Stroobandt B, et al. Substrate integrated components for passive millimeterwave-frequency beamforming networks. In: 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP). IEEE; 2021. p. 272–4.
- IEEE
- [1]L. Van Messem et al., “Substrate integrated components for passive millimeterwave-frequency beamforming networks,” in 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Chongqing, China, 2021, pp. 272–274.
@inproceedings{8733222,
abstract = {{In this paper, we propose passive millimeterwave (mmWave) components for Butler matrix beamforming networks implemented in grounded-coplanar waveguide (GCPW) technology designed for integration and co-optimization with an antenna array operating in the 28GHz 5G band. Within the frequency band of interest, covering the [26.5GHz-29.5GHz] spectrum, the insertion loss of the designed hybrid coupler and crossover stays well below 0.75 dB, while the amplitude imbalance remains below 0.5 dB and the phase imbalance does not exceed 5 degrees.}},
author = {{Van Messem, Laura and Moerman, Arno and Caytan, Olivier and Lima de Paula, Igor and Hoflack, Bram and Stroobandt, Bram and Lemey, Sam and Rogier, Hendrik}},
booktitle = {{2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)}},
isbn = {{9781665428194}},
keywords = {{Hybrid coupler,Crossover,GCPW,Multi-layer PCB,mmWave,5G,Beamforming,BUTLER MATRIX,ARRAY}},
language = {{eng}},
location = {{Chongqing, China}},
pages = {{272--274}},
publisher = {{IEEE}},
title = {{Substrate integrated components for passive millimeterwave-frequency beamforming networks}},
url = {{http://dx.doi.org/10.1109/IMWS-AMP53428.2021.9644020}},
year = {{2021}},
}
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