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Review on the integration of microelectronics for e-textile

(2021) MATERIALS. 14(17).
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Abstract
Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical, and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable, and washable to offer a superior usability, comfortability, and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile-adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.
Keywords
microelectronics, e-textile, smart textile, interconnection, textile-adapted

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MLA
Ahmmed, Abdella Simegnaw, et al. “Review on the Integration of Microelectronics for E-Textile.” MATERIALS, vol. 14, no. 17, 2021, doi:10.3390/ma14175113.
APA
Ahmmed, A. S., Malengier, B., Rotich, G., Tadesse, M. G., & Van Langenhove, L. (2021). Review on the integration of microelectronics for e-textile. MATERIALS, 14(17). https://doi.org/10.3390/ma14175113
Chicago author-date
Ahmmed, Abdella Simegnaw, Benny Malengier, Gideon Rotich, Melkie Getnet Tadesse, and Lieva Van Langenhove. 2021. “Review on the Integration of Microelectronics for E-Textile.” MATERIALS 14 (17). https://doi.org/10.3390/ma14175113.
Chicago author-date (all authors)
Ahmmed, Abdella Simegnaw, Benny Malengier, Gideon Rotich, Melkie Getnet Tadesse, and Lieva Van Langenhove. 2021. “Review on the Integration of Microelectronics for E-Textile.” MATERIALS 14 (17). doi:10.3390/ma14175113.
Vancouver
1.
Ahmmed AS, Malengier B, Rotich G, Tadesse MG, Van Langenhove L. Review on the integration of microelectronics for e-textile. MATERIALS. 2021;14(17).
IEEE
[1]
A. S. Ahmmed, B. Malengier, G. Rotich, M. G. Tadesse, and L. Van Langenhove, “Review on the integration of microelectronics for e-textile,” MATERIALS, vol. 14, no. 17, 2021.
@article{8719366,
  abstract     = {{Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical, and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable, and washable to offer a superior usability, comfortability, and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile-adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.}},
  articleno    = {{5113}},
  author       = {{Ahmmed, Abdella Simegnaw and Malengier, Benny and Rotich, Gideon and Tadesse, Melkie Getnet and Van Langenhove, Lieva}},
  issn         = {{1996-1944}},
  journal      = {{MATERIALS}},
  keywords     = {{microelectronics,e-textile,smart textile,interconnection,textile-adapted}},
  language     = {{eng}},
  number       = {{17}},
  pages        = {{26}},
  title        = {{Review on the integration of microelectronics for e-textile}},
  url          = {{http://dx.doi.org/10.3390/ma14175113}},
  volume       = {{14}},
  year         = {{2021}},
}

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