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Electronic-photonic board as an integration platform for Tb/s multi-chip optical communication

(2021) IET OPTOELECTRONICS. 15(2). p.92-101
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Abstract
Chip-on-board silicon photonics O-band wavelength-division multiplexing transceivers have been developed that will eventually enable high-throughput on-board optical communication for multi-socket on-board communication. This direct, any-to-any configuration yields low-latency, low-power optical communication among multiple compute nodes on the board. Silicon photonic transceiver chips are flip-chipped on a polymer waveguide containing an electro-optical circuit board using adiabatic coupling and then completed with driver and amplifier electronic chips. A transceiver assembly based on wire-bond technology verifies 50 Gb/s operation per channel, and the flip-chip version demonstrates the chip on-board assembly techniques for compact on-board transceivers.

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MLA
Lamprecht, Tobias, et al. “Electronic-Photonic Board as an Integration Platform for Tb/s Multi-Chip Optical Communication.” IET OPTOELECTRONICS, vol. 15, no. 2, 2021, pp. 92–101, doi:10.1049/ote2.12017.
APA
Lamprecht, T., Betschon, F., Bauwelinck, J., Van Kerrebrouck, J., Lambrecht, J., Gaul, H., … Yin, X. (2021). Electronic-photonic board as an integration platform for Tb/s multi-chip optical communication. IET OPTOELECTRONICS, 15(2), 92–101. https://doi.org/10.1049/ote2.12017
Chicago author-date
Lamprecht, Tobias, Felix Betschon, Johan Bauwelinck, Joris Van Kerrebrouck, Joris Lambrecht, Holger Gaul, Alexander Eichler, and Xin Yin. 2021. “Electronic-Photonic Board as an Integration Platform for Tb/s Multi-Chip Optical Communication.” IET OPTOELECTRONICS 15 (2): 92–101. https://doi.org/10.1049/ote2.12017.
Chicago author-date (all authors)
Lamprecht, Tobias, Felix Betschon, Johan Bauwelinck, Joris Van Kerrebrouck, Joris Lambrecht, Holger Gaul, Alexander Eichler, and Xin Yin. 2021. “Electronic-Photonic Board as an Integration Platform for Tb/s Multi-Chip Optical Communication.” IET OPTOELECTRONICS 15 (2): 92–101. doi:10.1049/ote2.12017.
Vancouver
1.
Lamprecht T, Betschon F, Bauwelinck J, Van Kerrebrouck J, Lambrecht J, Gaul H, et al. Electronic-photonic board as an integration platform for Tb/s multi-chip optical communication. IET OPTOELECTRONICS. 2021;15(2):92–101.
IEEE
[1]
T. Lamprecht et al., “Electronic-photonic board as an integration platform for Tb/s multi-chip optical communication,” IET OPTOELECTRONICS, vol. 15, no. 2, pp. 92–101, 2021.
@article{8702078,
  abstract     = {{Chip-on-board silicon photonics O-band wavelength-division multiplexing transceivers have been developed that will eventually enable high-throughput on-board optical communication for multi-socket on-board communication. This direct, any-to-any configuration yields low-latency, low-power optical communication among multiple compute nodes on the board. Silicon photonic transceiver chips are flip-chipped on a polymer waveguide containing an electro-optical circuit board using adiabatic coupling and then completed with driver and amplifier electronic chips. A transceiver assembly based on wire-bond technology verifies 50 Gb/s operation per channel, and the flip-chip version demonstrates the chip on-board assembly techniques for compact on-board transceivers.}},
  author       = {{Lamprecht, Tobias and Betschon, Felix and Bauwelinck, Johan and Van Kerrebrouck, Joris and Lambrecht, Joris and Gaul, Holger and Eichler, Alexander and Yin, Xin}},
  issn         = {{1751-8768}},
  journal      = {{IET OPTOELECTRONICS}},
  language     = {{eng}},
  number       = {{2}},
  pages        = {{92--101}},
  title        = {{Electronic-photonic board as an integration platform for Tb/s multi-chip optical communication}},
  url          = {{http://dx.doi.org/10.1049/ote2.12017}},
  volume       = {{15}},
  year         = {{2021}},
}

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