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Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling

(2021) OPTICS EXPRESS. 29(5). p.7601-7615
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Abstract
To increase the manufacturing throughput and lower the cost of silicon photonics packaging, an alignment tolerant approach is required to simplify the process of fiber-to-chip coupling. Here, we demonstrate an alignment-tolerant expanded beam backside coupling interface (in the O-band) for silicon photonics by monolithically integrating microlenses on the backside of the chip. After expanding the diffracted optical beam from a TE-mode grating through the bulk silicon substrate, the beam is collimated with the aid of microlenses resulting in an increased coupling tolerance to lateral and longitudinal misalignment. With an expanded beam diameter of 32 mu m, a +/- 7 mu m lateral and a +/- 0.6 degrees angular fiber-to-microlens 1-dB alignment tolerance is demonstrated at the wavelength of 1310 nm. Also, a large 300 mu m longitudinal alignment tolerance with a 0.2 dB drop in coupling efficiency is obtained when the collimated beam from the microlens is coupled into a thermally expanded core single-mode fiber. (C) 2021 Optical Society of America under the terms of the OSA Open Access Publishing Agreement
Keywords
microlens, silicon photonics, optical coupling, expanded beam, monolithic integration, ARRAYS

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MLA
Mangal, Nivesh, et al. “Monolithic Integration of Microlenses on the Backside of a Silicon Photonics Chip for Expanded Beam Coupling.” OPTICS EXPRESS, vol. 29, no. 5, 2021, pp. 7601–15, doi:10.1364/oe.412353.
APA
Mangal, N., Snyder, B., Van Campenhout, J., Van Steenberge, G., & Missinne, J. (2021). Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling. OPTICS EXPRESS, 29(5), 7601–7615. https://doi.org/10.1364/oe.412353
Chicago author-date
Mangal, Nivesh, Bradley Snyder, Joris Van Campenhout, Geert Van Steenberge, and Jeroen Missinne. 2021. “Monolithic Integration of Microlenses on the Backside of a Silicon Photonics Chip for Expanded Beam Coupling.” OPTICS EXPRESS 29 (5): 7601–15. https://doi.org/10.1364/oe.412353.
Chicago author-date (all authors)
Mangal, Nivesh, Bradley Snyder, Joris Van Campenhout, Geert Van Steenberge, and Jeroen Missinne. 2021. “Monolithic Integration of Microlenses on the Backside of a Silicon Photonics Chip for Expanded Beam Coupling.” OPTICS EXPRESS 29 (5): 7601–7615. doi:10.1364/oe.412353.
Vancouver
1.
Mangal N, Snyder B, Van Campenhout J, Van Steenberge G, Missinne J. Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling. OPTICS EXPRESS. 2021;29(5):7601–15.
IEEE
[1]
N. Mangal, B. Snyder, J. Van Campenhout, G. Van Steenberge, and J. Missinne, “Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling,” OPTICS EXPRESS, vol. 29, no. 5, pp. 7601–7615, 2021.
@article{8699614,
  abstract     = {{To increase the manufacturing throughput and lower the cost of silicon photonics packaging, an alignment tolerant approach is required to simplify the process of fiber-to-chip coupling. Here, we demonstrate an alignment-tolerant expanded beam backside coupling interface (in the O-band) for silicon photonics by monolithically integrating microlenses on the backside of the chip. After expanding the diffracted optical beam from a TE-mode grating through the bulk silicon substrate, the beam is collimated with the aid of microlenses resulting in an increased coupling tolerance to lateral and longitudinal misalignment. With an expanded beam diameter of 32 mu m, a +/- 7 mu m lateral and a +/- 0.6 degrees angular fiber-to-microlens 1-dB alignment tolerance is demonstrated at the wavelength of 1310 nm. Also, a large 300 mu m longitudinal alignment tolerance with a 0.2 dB drop in coupling efficiency is obtained when the collimated beam from the microlens is coupled into a thermally expanded core single-mode fiber. (C) 2021 Optical Society of America under the terms of the OSA Open Access Publishing Agreement}},
  author       = {{Mangal, Nivesh and Snyder, Bradley and Van Campenhout, Joris and Van Steenberge, Geert and Missinne, Jeroen}},
  issn         = {{1094-4087}},
  journal      = {{OPTICS EXPRESS}},
  keywords     = {{microlens,silicon photonics,optical coupling,expanded beam,monolithic integration,ARRAYS}},
  language     = {{eng}},
  number       = {{5}},
  pages        = {{7601--7615}},
  title        = {{Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling}},
  url          = {{http://doi.org/10.1364/oe.412353}},
  volume       = {{29}},
  year         = {{2021}},
}

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