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This paper demonstrates that fan-out wafer-level packaging (FOWLP) can enable high-Q integrated passive devices (IPDs) on low-loss mold compound materials. Moreover, we show that thick ferrite cores can be embedded into FOWLP, further enhancing the RF performance to meet the requirements of power applications. The obtained IPD performance indicates that this approach can lead to a cost-effective packaging solution for the overall product offering.

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MLA
Sun, Xiao, et al. “Integrated Magnetic Cores in FOWLP and Their Applications.” 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), IEEE, 2020, doi:10.1109/ectc32862.2020.00216.
APA
Sun, X., Slabbekoorn, J., Velenis, D., Bex, P., Duval, F., Sterken, T., … Beyne, E. (2020). Integrated magnetic cores in FOWLP and their applications. In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). Orlando, USA: IEEE. https://doi.org/10.1109/ectc32862.2020.00216
Chicago author-date
Sun, Xiao, John Slabbekoorn, Dimitrios Velenis, Pieter Bex, Fabrice Duval, Tom Sterken, Giacomo Talmelli, et al. 2020. “Integrated Magnetic Cores in FOWLP and Their Applications.” In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE. https://doi.org/10.1109/ectc32862.2020.00216.
Chicago author-date (all authors)
Sun, Xiao, John Slabbekoorn, Dimitrios Velenis, Pieter Bex, Fabrice Duval, Tom Sterken, Giacomo Talmelli, Inge de Preter, Tomas Webers, Christoph Adelmann, Andy Miller, Geert Van der Plas, and Eric Beyne. 2020. “Integrated Magnetic Cores in FOWLP and Their Applications.” In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE. doi:10.1109/ectc32862.2020.00216.
Vancouver
1.
Sun X, Slabbekoorn J, Velenis D, Bex P, Duval F, Sterken T, et al. Integrated magnetic cores in FOWLP and their applications. In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE; 2020.
IEEE
[1]
X. Sun et al., “Integrated magnetic cores in FOWLP and their applications,” in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, USA, 2020.
@inproceedings{8672826,
  abstract     = {This paper demonstrates that fan-out wafer-level packaging (FOWLP) can enable high-Q integrated passive devices (IPDs) on low-loss mold compound materials. Moreover, we show that thick ferrite cores can be embedded into FOWLP, further enhancing the RF performance to meet the requirements of power applications. The obtained IPD performance indicates that this approach can lead to a cost-effective packaging solution for the overall product offering.},
  author       = {Sun, Xiao and Slabbekoorn, John and Velenis, Dimitrios and Bex, Pieter and Duval, Fabrice and Sterken, Tom and Talmelli, Giacomo and de Preter, Inge and Webers, Tomas and Adelmann, Christoph and Miller, Andy and Van der Plas, Geert and Beyne, Eric},
  booktitle    = {2020 IEEE 70th Electronic Components and Technology Conference (ECTC)},
  isbn         = {9781728161808},
  issn         = {0569-5503},
  language     = {eng},
  location     = {Orlando, USA},
  pages        = {6},
  publisher    = {IEEE},
  title        = {Integrated magnetic cores in FOWLP and their applications},
  url          = {http://dx.doi.org/10.1109/ectc32862.2020.00216},
  year         = {2020},
}

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