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400 Gb/s silicon photonic transmitter and routing WDM technologies for glueless 8-socket chip-to-chip interconnects

(2020) JOURNAL OF LIGHTWAVE TECHNOLOGY. 38(13). p.3366-3375
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Organization
Abstract
Arrayed Waveguide Grating Router (AWGR)-based interconnections for Multi-Socket Server Boards (MSBs) have been identified as a promising solution to replace the electrical interconnects in glueless MSBs towards boosting processing performance. In this article, we present an 8-socket glueless optical flat-topology Wavelength Division Multiplexing (WDM)-based point-to-point (P2P) interconnect pursued within the H2020 ICT project ICT-STREAMS and we report on our latest achievements in the deployment of the constituent silicon (Si)-photonic transmitter and routing building blocks, exploiting experimentally obtained performance metrics for analyzing the 8-socket chip-to-chip (C2C) connectivity in terms of throughput and energy efficiency. We demonstrate an 8-channel WDM Si-photonic microring-based transmitter (Tx) capable of providing 400 (8 x 50) Gb/s non-return-to-zero (NRZ) Tx capacity and an 8 x 8 Coarse-WDM (CWDM) Si-AWGR with verified cyclic data routing capability in O-band. Following an overview of our recently demonstrated crosstalk (XT)-aware wavelength allocation scheme, that enables fully-loaded AWGR-based interconnects even for typical sub-optimal XT values of silicon integrated CWDM AWGRs, we validate the performance of a full-scale 8-socket interconnect architecture through physical layer simulations exploiting experimentally-verified simulation models for the underlying Si-photonic Tx and routing circuits. This analysis reveals a total aggregate capacity of 1.4 Tb/s for an 8-socket interconnect when operating with 25 Gb/s line-rates, which can scale to 2.8 Tb/s at an energy efficiency of just 5.02 pJ/bit by exploiting the experimentally verified building block performance at 50 Gb/s line. This highlights the perspectives for up to 69% energy savings compared to the standard QuickPath Interconnect (QPI) typically employed in electronic glueless MSB interconnects, while scaling the single-hop flat connectivity from 4- to 8-socket interconnection systems.
Keywords
ON-CHIP, CROSSTALK, Integrated circuit interconnections, Wavelength division multiplexing, Sockets, Optical interconnections, Silicon, Optical transmitters, Optical waveguides, AWGR, AWGR-based interconnections, computing, architectures, MSBs, optical interconnections, optical transmitters, photonic integrated circuits, silicon photonics

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Citation

Please use this url to cite or link to this publication:

MLA
Pitris, Stelios, et al. “400 Gb/s Silicon Photonic Transmitter and Routing WDM Technologies for Glueless 8-Socket Chip-to-Chip Interconnects.” JOURNAL OF LIGHTWAVE TECHNOLOGY, vol. 38, no. 13, 2020, pp. 3366–75, doi:10.1109/JLT.2020.2977369.
APA
Pitris, S., Mitsolidou, C., Moralis-Pegios, M., Fotiadis, K., Ban, Y., De Heyn, P., … Alexoudi, T. (2020). 400 Gb/s silicon photonic transmitter and routing WDM technologies for glueless 8-socket chip-to-chip interconnects. JOURNAL OF LIGHTWAVE TECHNOLOGY, 38(13), 3366–3375. https://doi.org/10.1109/JLT.2020.2977369
Chicago author-date
Pitris, Stelios, Charoula Mitsolidou, Miltiadis Moralis-Pegios, Konstantinos Fotiadis, Yoojin Ban, Peter De Heyn, Joris Van Campenhout, et al. 2020. “400 Gb/s Silicon Photonic Transmitter and Routing WDM Technologies for Glueless 8-Socket Chip-to-Chip Interconnects.” JOURNAL OF LIGHTWAVE TECHNOLOGY 38 (13): 3366–75. https://doi.org/10.1109/JLT.2020.2977369.
Chicago author-date (all authors)
Pitris, Stelios, Charoula Mitsolidou, Miltiadis Moralis-Pegios, Konstantinos Fotiadis, Yoojin Ban, Peter De Heyn, Joris Van Campenhout, Joris Lambrecht, Hannes Ramon, Xin Yin, Johan Bauwelinck, Nikos Pleros, and Theonitsa Alexoudi. 2020. “400 Gb/s Silicon Photonic Transmitter and Routing WDM Technologies for Glueless 8-Socket Chip-to-Chip Interconnects.” JOURNAL OF LIGHTWAVE TECHNOLOGY 38 (13): 3366–3375. doi:10.1109/JLT.2020.2977369.
Vancouver
1.
Pitris S, Mitsolidou C, Moralis-Pegios M, Fotiadis K, Ban Y, De Heyn P, et al. 400 Gb/s silicon photonic transmitter and routing WDM technologies for glueless 8-socket chip-to-chip interconnects. JOURNAL OF LIGHTWAVE TECHNOLOGY. 2020;38(13):3366–75.
IEEE
[1]
S. Pitris et al., “400 Gb/s silicon photonic transmitter and routing WDM technologies for glueless 8-socket chip-to-chip interconnects,” JOURNAL OF LIGHTWAVE TECHNOLOGY, vol. 38, no. 13, pp. 3366–3375, 2020.
@article{8671341,
  abstract     = {{Arrayed Waveguide Grating Router (AWGR)-based interconnections for Multi-Socket Server Boards (MSBs) have been identified as a promising solution to replace the electrical interconnects in glueless MSBs towards boosting processing performance. In this article, we present an 8-socket glueless optical flat-topology Wavelength Division Multiplexing (WDM)-based point-to-point (P2P) interconnect pursued within the H2020 ICT project ICT-STREAMS and we report on our latest achievements in the deployment of the constituent silicon (Si)-photonic transmitter and routing building blocks, exploiting experimentally obtained performance metrics for analyzing the 8-socket chip-to-chip (C2C) connectivity in terms of throughput and energy efficiency. We demonstrate an 8-channel WDM Si-photonic microring-based transmitter (Tx) capable of providing 400 (8 x 50) Gb/s non-return-to-zero (NRZ) Tx capacity and an 8 x 8 Coarse-WDM (CWDM) Si-AWGR with verified cyclic data routing capability in O-band. Following an overview of our recently demonstrated crosstalk (XT)-aware wavelength allocation scheme, that enables fully-loaded AWGR-based interconnects even for typical sub-optimal XT values of silicon integrated CWDM AWGRs, we validate the performance of a full-scale 8-socket interconnect architecture through physical layer simulations exploiting experimentally-verified simulation models for the underlying Si-photonic Tx and routing circuits. This analysis reveals a total aggregate capacity of 1.4 Tb/s for an 8-socket interconnect when operating with 25 Gb/s line-rates, which can scale to 2.8 Tb/s at an energy efficiency of just 5.02 pJ/bit by exploiting the experimentally verified building block performance at 50 Gb/s line. This highlights the perspectives for up to 69% energy savings compared to the standard QuickPath Interconnect (QPI) typically employed in electronic glueless MSB interconnects, while scaling the single-hop flat connectivity from 4- to 8-socket interconnection systems.}},
  author       = {{Pitris, Stelios and Mitsolidou, Charoula and Moralis-Pegios, Miltiadis and Fotiadis, Konstantinos and Ban, Yoojin and De Heyn, Peter and Van Campenhout, Joris and Lambrecht, Joris and Ramon, Hannes and Yin, Xin and Bauwelinck, Johan and Pleros, Nikos and Alexoudi, Theonitsa}},
  issn         = {{0733-8724}},
  journal      = {{JOURNAL OF LIGHTWAVE TECHNOLOGY}},
  keywords     = {{ON-CHIP,CROSSTALK,Integrated circuit interconnections,Wavelength division multiplexing,Sockets,Optical interconnections,Silicon,Optical transmitters,Optical waveguides,AWGR,AWGR-based interconnections,computing,architectures,MSBs,optical interconnections,optical transmitters,photonic integrated circuits,silicon photonics}},
  language     = {{eng}},
  number       = {{13}},
  pages        = {{3366--3375}},
  title        = {{400 Gb/s silicon photonic transmitter and routing WDM technologies for glueless 8-socket chip-to-chip interconnects}},
  url          = {{http://dx.doi.org/10.1109/JLT.2020.2977369}},
  volume       = {{38}},
  year         = {{2020}},
}

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