Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics
- Author
- Nivesh Mangal, Bradley Snyder, Joris Van Campenhout, Geert Van Steenberge (UGent) and Jeroen Missinne (UGent)
- Organization
- Abstract
- We demonstrate an alignment-tolerant backside coupling interface in the O-band for silicon photonics by generating an optimized through-substrate (downward) directionality beam from a TE-mode grating coupler and hybrid integrating the chip with backside silicon microlenses to achieve expanded beam collimation. The key advantage of using such an expanded beam interface is an increased coupling tolerance to lateral and longitudinal misalignment. A 34 mu m beam diameter was achieved over a combined substrate thickness of 630 mu m which was then coupled to a thermally expanded core single-mode fiber to investigate the tolerances. A 1-dB fiber-to-microlens lateral alignment tolerance of 14 mu m and an angular alignment tolerance of 1 degrees was measured at a wavelength of 1310 nm. In addition, a large +/- 2.5 mu m 1-dB backside alignment accuracy was measured for the placement of microlens with respect to the grating. The radius of curvature of Si microlens to achieve a collimated beam was 480 mu m, and a 1-dB longitudinal alignment tolerance of 700 mu m was measured for coupling to a single-mode expanded core fiber. The relaxation in alignment tolerances make the demonstrated coupling interface suitable for chip-to-package or chip-to-board coupling
- Keywords
- Electrical and Electronic Engineering, Atomic and Molecular Physics, Optics, Lenses, Photonics, Microoptics, Couplings, Silicon, Gratings, Couplers, Optical interposer, silicon photonics, microlenses, collimator, expanded core fibers, grating couplers, LENS, FIBER
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-8653488
- MLA
- Mangal, Nivesh, et al. “Expanded-Beam Backside Coupling Interface for Alignment-Tolerant Packaging of Silicon Photonics.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, vol. 26, no. 2, 2020, doi:10.1109/jstqe.2019.2934161.
- APA
- Mangal, N., Snyder, B., Van Campenhout, J., Van Steenberge, G., & Missinne, J. (2020). Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics. IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 26(2). https://doi.org/10.1109/jstqe.2019.2934161
- Chicago author-date
- Mangal, Nivesh, Bradley Snyder, Joris Van Campenhout, Geert Van Steenberge, and Jeroen Missinne. 2020. “Expanded-Beam Backside Coupling Interface for Alignment-Tolerant Packaging of Silicon Photonics.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 26 (2). https://doi.org/10.1109/jstqe.2019.2934161.
- Chicago author-date (all authors)
- Mangal, Nivesh, Bradley Snyder, Joris Van Campenhout, Geert Van Steenberge, and Jeroen Missinne. 2020. “Expanded-Beam Backside Coupling Interface for Alignment-Tolerant Packaging of Silicon Photonics.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 26 (2). doi:10.1109/jstqe.2019.2934161.
- Vancouver
- 1.Mangal N, Snyder B, Van Campenhout J, Van Steenberge G, Missinne J. Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics. IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS. 2020;26(2).
- IEEE
- [1]N. Mangal, B. Snyder, J. Van Campenhout, G. Van Steenberge, and J. Missinne, “Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics,” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, vol. 26, no. 2, 2020.
@article{8653488,
abstract = {{We demonstrate an alignment-tolerant backside coupling interface in the O-band for silicon photonics by generating an optimized through-substrate (downward) directionality beam from a TE-mode grating coupler and hybrid integrating the chip with backside silicon microlenses to achieve expanded beam collimation. The key advantage of using such an expanded beam interface is an increased coupling tolerance to lateral and longitudinal misalignment. A 34 mu m beam diameter was achieved over a combined substrate thickness of 630 mu m which was then coupled to a thermally expanded core single-mode fiber to investigate the tolerances. A 1-dB fiber-to-microlens lateral alignment tolerance of 14 mu m and an angular alignment tolerance of 1 degrees was measured at a wavelength of 1310 nm. In addition, a large +/- 2.5 mu m 1-dB backside alignment accuracy was measured for the placement of microlens with respect to the grating. The radius of curvature of Si microlens to achieve a collimated beam was 480 mu m, and a 1-dB longitudinal alignment tolerance of 700 mu m was measured for coupling to a single-mode expanded core fiber. The relaxation in alignment tolerances make the demonstrated coupling interface suitable for chip-to-package or chip-to-board coupling}},
articleno = {{8300807}},
author = {{Mangal, Nivesh and Snyder, Bradley and Van Campenhout, Joris and Van Steenberge, Geert and Missinne, Jeroen}},
issn = {{1077-260X}},
journal = {{IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS}},
keywords = {{Electrical and Electronic Engineering,Atomic and Molecular Physics,Optics,Lenses,Photonics,Microoptics,Couplings,Silicon,Gratings,Couplers,Optical interposer,silicon photonics,microlenses,collimator,expanded core fibers,grating couplers,LENS,FIBER}},
language = {{eng}},
number = {{2}},
pages = {{7}},
title = {{Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics}},
url = {{http://doi.org/10.1109/jstqe.2019.2934161}},
volume = {{26}},
year = {{2020}},
}
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