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Effect of overmolding process on the integrity of electronic circuits

Mona Bakr (UGent) , Yibo Su, Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)
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MLA
Bakr, Mona, et al. “Effect of Overmolding Process on the Integrity of Electronic Circuits.” 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), IEEE, 2019, doi:10.23919/empc44848.2019.8951797.
APA
Bakr, M., Su, Y., Bossuyt, F., & Vanfleteren, J. (2019). Effect of overmolding process on the integrity of electronic circuits. In 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). Pisa, Italy: IEEE. https://doi.org/10.23919/empc44848.2019.8951797
Chicago author-date
Bakr, Mona, Yibo Su, Frederick Bossuyt, and Jan Vanfleteren. 2019. “Effect of Overmolding Process on the Integrity of Electronic Circuits.” In 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE. https://doi.org/10.23919/empc44848.2019.8951797.
Chicago author-date (all authors)
Bakr, Mona, Yibo Su, Frederick Bossuyt, and Jan Vanfleteren. 2019. “Effect of Overmolding Process on the Integrity of Electronic Circuits.” In 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE. doi:10.23919/empc44848.2019.8951797.
Vancouver
1.
Bakr M, Su Y, Bossuyt F, Vanfleteren J. Effect of overmolding process on the integrity of electronic circuits. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE; 2019.
IEEE
[1]
M. Bakr, Y. Su, F. Bossuyt, and J. Vanfleteren, “Effect of overmolding process on the integrity of electronic circuits,” in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), Pisa, Italy, 2019.
@inproceedings{8649172,
  author       = {Bakr, Mona and Su, Yibo and Bossuyt, Frederick and Vanfleteren, Jan},
  booktitle    = {2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)},
  isbn         = {9780956808660},
  language     = {eng},
  location     = {Pisa, Italy},
  pages        = {8},
  publisher    = {IEEE},
  title        = {Effect of overmolding process on the integrity of electronic circuits},
  url          = {http://dx.doi.org/10.23919/empc44848.2019.8951797},
  year         = {2019},
}

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