Chip-to-chip interconnect for 8-socket direct connectivity using 25Gb/s O-band integrated transceiver and routing circuits
- Author
- Miltiadis Moralis-Pegios, Stelios Pitris, Theonitsa Alexoudi, Joris Lambrecht (UGent) , Xin Yin (UGent) , Johan Bauwelinck (UGent) , Yoojiin Ban, Peter De Heyn (UGent) , Marianna Pantouvaki, Joris Van Campenhout and Nikos Pleros
- Organization
- Abstract
- We present an O-band Chip-to-Chip Interconnect for 8-socket direct connectivity exploiting a Si-based Ring Modulator and a packaged PD-TIA connected over a Si-based 8×8 AWGR routing module. Eight routing scenarios are experimentally demonstrated at 25Gb/s revealing error-free operation.
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Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-8647240
- MLA
- Moralis-Pegios, Miltiadis, et al. “Chip-to-Chip Interconnect for 8-Socket Direct Connectivity Using 25Gb/s O-Band Integrated Transceiver and Routing Circuits.” 2018 European Conference on Optical Communication (ECOC), IEEE, 2018, doi:10.1109/ecoc.2018.8535215.
- APA
- Moralis-Pegios, M., Pitris, S., Alexoudi, T., Lambrecht, J., Yin, X., Bauwelinck, J., … Pleros, N. (2018). Chip-to-chip interconnect for 8-socket direct connectivity using 25Gb/s O-band integrated transceiver and routing circuits. 2018 European Conference on Optical Communication (ECOC). Presented at the European Conference on Optical Communication (ECOC 2018), Rome, Italy. https://doi.org/10.1109/ecoc.2018.8535215
- Chicago author-date
- Moralis-Pegios, Miltiadis, Stelios Pitris, Theonitsa Alexoudi, Joris Lambrecht, Xin Yin, Johan Bauwelinck, Yoojiin Ban, et al. 2018. “Chip-to-Chip Interconnect for 8-Socket Direct Connectivity Using 25Gb/s O-Band Integrated Transceiver and Routing Circuits.” In 2018 European Conference on Optical Communication (ECOC). IEEE. https://doi.org/10.1109/ecoc.2018.8535215.
- Chicago author-date (all authors)
- Moralis-Pegios, Miltiadis, Stelios Pitris, Theonitsa Alexoudi, Joris Lambrecht, Xin Yin, Johan Bauwelinck, Yoojiin Ban, Peter De Heyn, Marianna Pantouvaki, Joris Van Campenhout, and Nikos Pleros. 2018. “Chip-to-Chip Interconnect for 8-Socket Direct Connectivity Using 25Gb/s O-Band Integrated Transceiver and Routing Circuits.” In 2018 European Conference on Optical Communication (ECOC). IEEE. doi:10.1109/ecoc.2018.8535215.
- Vancouver
- 1.Moralis-Pegios M, Pitris S, Alexoudi T, Lambrecht J, Yin X, Bauwelinck J, et al. Chip-to-chip interconnect for 8-socket direct connectivity using 25Gb/s O-band integrated transceiver and routing circuits. In: 2018 European Conference on Optical Communication (ECOC). IEEE; 2018.
- IEEE
- [1]M. Moralis-Pegios et al., “Chip-to-chip interconnect for 8-socket direct connectivity using 25Gb/s O-band integrated transceiver and routing circuits,” in 2018 European Conference on Optical Communication (ECOC), Rome, Italy, 2018.
@inproceedings{8647240,
abstract = {{We present an O-band Chip-to-Chip Interconnect for 8-socket direct connectivity exploiting a Si-based Ring Modulator and a packaged PD-TIA connected over a Si-based 8×8 AWGR routing module. Eight routing scenarios are experimentally demonstrated at 25Gb/s revealing error-free operation.}},
author = {{Moralis-Pegios, Miltiadis and Pitris, Stelios and Alexoudi, Theonitsa and Lambrecht, Joris and Yin, Xin and Bauwelinck, Johan and Ban, Yoojiin and De Heyn, Peter and Pantouvaki, Marianna and Van Campenhout, Joris and Pleros, Nikos}},
booktitle = {{2018 European Conference on Optical Communication (ECOC)}},
isbn = {{9781538648629}},
language = {{eng}},
location = {{Rome, Italy}},
pages = {{3}},
publisher = {{IEEE}},
title = {{Chip-to-chip interconnect for 8-socket direct connectivity using 25Gb/s O-band integrated transceiver and routing circuits}},
url = {{http://dx.doi.org/10.1109/ecoc.2018.8535215}},
year = {{2018}},
}
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